Texas Instruments TS3A227E, Руководство пользователя

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TS3A227E
TS3A227E Jack
Codec Jack Ring1
RING2
MSP40 LaunchPad
Adjustable
LDO
VDD
VCC
2.2 k
VCC
3.6 V
Translator
VCCB VCCA
TIP
/DET_TRIGGER
RING2_SENSE
SLEEVE
SLEEVE_SENSE
SDA
SCL
/MIC_PRESENT
/INT
MICP
GND_SENSE
GNDA
GND
VDDIO
KP Demo Buttons
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Introduction
3 Introduction
The TS3A227E-EVM is an evaluation module for TI's autonomous audio jack switch with integrated key-
press detection and power off noise removal. Designed to interact with the audio jack, the device
automatically detects the presence of 3- or 4-pole audio accessories and also features an integrated
switch matrix for automatic routing of the MICBIAS, codec ground sense, and ground connections.
The device also incorporates a high-resolution ADC for distinguishing from up to four keys in the default
mode. Additionally, the TS3A227E features the ability for on-the-fly key-press bin adjustment and a raw
ADC output mode to add the ability for the system to define non-standard key-press bins, as desired.
The evaluation board is designed both as a demonstration and development board by using the MSP430
LaunchPad™ as a base platform for interacting with the device. There is an example firmware stack and
GUI provided with the EVM.
Figure 1 is a block diagram of the EVM structure.
Figure 1. TS3A227E-EVM Block Diagram
3.1 Hardware Items for Operation
The following items are required for EVM evaluation:
• TS3A227E-EVM
• MSP-EXP430G2 LaunchPad Rev 1.5
• MSP430G2553
• USB cable
The following items are optional for EVM evaluation:
• 4-pole headset
• 3-pole headset
• Code Composer Studio™ (CCS)
• Visual Studio 2012
3 SLVUAD9 – December 2014 TS3A227E EVM User's Guide
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