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Test Point Descriptions

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4

SLVUB26C – May 2017 – Revised June 2018

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Copyright © 2017–2018, Texas Instruments Incorporated

Operating TPSM846C23 in Parallel

3

Test Point Descriptions

Wire-loop test points and scope probe test points are provided as convenient connection points for digital
voltmeters (DVM) or oscilloscope probes to aid in the evaluation of the device. A description of each test
point follows:

Table 1. Test Points

VIN

Input voltage monitor. Connect DVM to this point for measuring efficiency.

VS+

Supply path output voltage monitor. Connect DVM positive lead to this point for line regulation and load
regulation.

VS–

Return path output voltage monitor. Connect DVM negative lead to this point for measuring line regulation
and load regulation.

VOUT

Output voltage monitor. Connect DVM to this point and PGND for measuring efficiency.

PGND

Input and output voltage monitor grounds. Reference the VIN and VOUT DVMs to these ground points.

VIN MON (J1)

Input voltage scope monitor. Connect an oscilloscope to this set of points to measure input ripple voltage.

VOUT MON (J2)

Output voltage scope monitor. Connect an oscilloscope to this set of points to measure output ripple voltage
and transient response.

AGND

Analog ground point. Use any of the AGND test points as the ground reference for the control signals.

ALERT

PMBus ALERT line, used to monitor the ALERT signal.

CLK

PMBus CLK line, used to monitor the CLK signal.

DATA

PMBus DATA line, used to monitor the DATA signal.

CNTL

Control pin. Pull to AGND to stop power conversion. Float or pull to 3.3 V to enable power conversion. An
internal 10-k

Ω

pullup resistor to 3.3 V is present on the EVM.

EXT CLK

External clock input. This is the input to a D flip-flop. Apply an external clock at a frequency that is twice the
required switching frequency. Remove R13 before applying the clock signal.

SYNC

SYNC monitor pin. This pin is the output of a D flip-flop which supplies a clock to both devices.

PGOOD

Monitors the power good signal of the device. This is an open drain signal that has an on-board 10-k

Ω

pullup

resistor the 3.3 V.

DIFFO

Output of remote sense differential amplifier.

Signal

Signal injection point for Bode plot analyzer. Inject from Signal to CHB.

CHA

Input signal monitoring point for Bode plot analyzer.

CHB

Output signal monitoring point for Bode plot analyzer.

PH1

Switch node of the TPSM846C23 Master device (U1). Use an unshielded scope probe to monitor this point.

PH2

Switch node of the TPSM846C23 Slave device (U2). Use an unshielded scope probe to monitor this point.

NOTE:

Refer to the product data sheet (

SLVSDF3

) for absolute maximum ratings associated with

features in

Table 1

.

Содержание TPSM846C23

Страница 1: ...escription 2 2 Getting Started 2 3 Test Point Descriptions 4 4 Operation Notes 5 5 Performance Data 6 6 Schematic 7 7 Bill of Material 8 8 PCB Layout 9 List of Figures 1 EVM User Interface 2 2 Efficie...

Страница 2: ...eling two TPSM846C23 power modules Monitoring test points are provided to allow measurement of efficiency power dissipation input ripple output ripple line and load regulation and transient response A...

Страница 3: ...rface GUI to communicate and control the EVM To download the latest software visit http www ti com tool fusion_digital_power_designer The ALERT DATA CLK and CNTL test points are used to monitor and co...

Страница 4: ...onse AGND Analog ground point Use any of the AGND test points as the ground reference for the control signals ALERT PMBus ALERT line used to monitor the ALERT signal CLK PMBus CLK line used to monitor...

Страница 5: ...g frequency is required R23 must be removed from the clock circuit on the bottom of the EVM and an external clock must be connected to the EXT CLK test point The external clock applied to EXT CLK test...

Страница 6: ...Power Dissipation W 0 10 20 30 40 50 60 70 0 2 4 6 8 10 12 14 16 18 D002 1 8 V 1 2 V 0 8 V Performance Data www ti com 6 SLVUB26C May 2017 Revised June 2018 Submit Documentation Feedback Copyright 201...

Страница 7: ...38 VOUT 39 VOUT 40 VOUT 41 VOUT 55 PGND 33 PGND 54 VIN 45 VIN 44 ADDR0 17 PGND 56 PGND 57 VIN 46 DIFFO 6 VS 4 PGND 36 VIN 53 AGND 10 BP6_RTN 48 PGND 32 PGND 58 BP3 47 BP6 49 VINBP 50 ADDR1 16 U2 TPSM...

Страница 8: ...nik J1 J2 2 Socket Strip 2x1 100mil Black Tin TH 310 43 102 41 001000 Mill Max P1 1 Header 2 54mm 5 2 Gold TH AWHW 10G 0202 T Assmann WSW P2 P4 2 Header 100mil 2 2 Tin TH PEC02DAAN Sullins Connector S...

Страница 9: ...ntation Feedback Copyright 2017 2018 Texas Instruments Incorporated Operating TPSM846C23 in Parallel 8 PCB Layout Figure 6 through Figure 13 illustrate the EVM PCB layout images Figure 6 Top Component...

Страница 10: ...7 Revised June 2018 Submit Documentation Feedback Copyright 2017 2018 Texas Instruments Incorporated Operating TPSM846C23 in Parallel Figure 10 Layer 4 Copper Figure 11 Layer 5 Copper Figure 12 Bottom...

Страница 11: ...E Page numbers for previous revisions may differ from page numbers in the current version Changes from B Revision December 2017 to C Revision Page Corrected resistor references R18 and R23 5 Changes f...

Страница 12: ...set forth above or credit User s account for such EVM TI s liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that...

Страница 13: ...the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain great...

Страница 14: ...t the EVM user guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the...

Страница 15: ...OST OF REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF...

Страница 16: ...TI Resource NO OTHER LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD...

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