User’s Guide
TPSM8286xAA0xEVM Evaluation Module
ABSTRACT
The TPSM8286xAA0xEVM facilitates the evaluation of the TPSM82864AA0SRDJR and TPSM82866AA0SRDJR
4-A and 6-A pin-to-pin compatible step-down power modules with DCS-Control in a 3.5-mm × 4-mm x 1.4-mm
overmolded QFN package and the TPSM82864AA0HRDMR and TPSM82866AA0HRDMR 4-A and 6-A pin-to-
pin compatible step-down power modules with DCS-Control in a 3.5-mm × 4-mm x 1.8-mm overmolded QFN
package. The EVMs provide a 1.2-V output voltage with 1% accuracy for input voltages from 2.4 V to 5.5 V. The
TPSM82864A and TPSM82866A are high-efficiency and small solutions for the following:
• Point-of-load (POL) power in applications such as the core supply for FPGAs, CPUs, and ASICs
• Optical modules
• Medical imaging
• Industrial transport
• Solid state drives (SSDs)
• Other space-limited applications
Table of Contents
1 Introduction
.............................................................................................................................................................................
2
1.1 Performance Specification.................................................................................................................................................
2
1.2 Modifications......................................................................................................................................................................
2
2 Setup
........................................................................................................................................................................................
4
2.1 Setup..................................................................................................................................................................................
4
2.2 Input, Output Connector and Jumper Descriptions............................................................................................................
4
3 Safety Instructions
..................................................................................................................................................................
4
4 Test Results
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5
5 Board Layout
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7
6 Schematic and Bill of Materials
.............................................................................................................................................
7
6.1 Schematic..........................................................................................................................................................................
8
6.2 Bill of Materials...................................................................................................................................................................
9
7 Revision History
......................................................................................................................................................................
9
List of Figures
Figure 1-1. Loop Response Measurement Modification..............................................................................................................
3
Figure 4-1. Thermal Performance (TPSM82866AA0SEVM, V
IN
= 5 V, V
OUT
= 1.2 V, I
OUT
= 6 A)...............................................
5
Figure 4-2. Thermal Performance (TPSM82866AA0HEVM, V
IN
= 5 V, V
OUT
= 1.2 V, I
OUT
= 6 A)..............................................
5
Figure 4-3. Loop Response Measurement (V
IN
= 5 V, V
OUT
= 1.2 V, I
OUT
= 6 A)........................................................................
6
Figure 5-1. Top Assembly............................................................................................................................................................
7
Figure 5-2. Top Layer...................................................................................................................................................................
7
Figure 5-3. Internal Layer 1.........................................................................................................................................................
7
Figure 5-4. Internal Layer 2.........................................................................................................................................................
7
Figure 5-5. Bottom Layer.............................................................................................................................................................
7
Figure 5-6. Bottom Layer (Mirrored)............................................................................................................................................
7
Figure 6-1. TPSM8286xAA0xEVM Schematic............................................................................................................................
8
List of Tables
Table 1-1. Performance Specification Summary..........................................................................................................................
2
Table 6-1. TPSM8286xAA0xEVM Bill of Materials......................................................................................................................
9
Trademarks
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Table of Contents
SLVUCB0A – SEPTEMBER 2021 – REVISED NOVEMBER 2022
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