(
)
[
]
R2
V
V
V
V
-
V
I
D4
D3
D2
D1
IN
LED
+
+
+
=
Introduction
www.ti.com
1
Introduction
The Texas Instruments TPS61165EVM-283 evaluation module contains a TPS61165 IC, supporting active
and passive components and three white light-emitting diodes (WLEDs) in series. The goal of this EVM is
to facilitate evaluation of the TPS61165 in a typical WLED application.
1.1
Performance Specification Summary
provides a summary of the TPS61165EVM-283 performance specifications. All specifications are
given for an ambient temperature of 25°C.
Table 1. Typical Performance Specification Summary
CONDITION
MIN
TYP
MAX
UNITS
V
IN
supply
4.5
5
5.5
V
CTRL=VIN, JP2 shorted
9.5
V
VOUT
CTRL=VIN, JP2 open
37
38
39
V
IOUT
CTRL=VIN, JP2 shorted
347
357
368
mA
The EVM was designed and tested for an input voltage of 5 V +/-10%. Lower input voltages may result in
the part entering current limit and therefore not providing the regulated current in the specification table.
Input voltages greater than the drop across the sum of D2-D4 but less than the 18-V maximum do not
damage the IC but cause the IC to stop switching and regulating current. At this time, the input voltage,
less the drop across D1, is applied across D2-D4, setting the current to that as shown in
(1)
Currents higher than the LEDs' 500-mA maximum rating can damage the LEDs.
1.2
Modifications
To aid user customization of the EVM, the board was designed with devices having 0603 or larger
footprints. A real world implementation would likely occupy less total board space.
The inductor and compensation components (R1, C2) were designed for the VIN range in Table 1. Using
a different input voltage range may require resizing of the inductor and/or the compensation components.
Also, changing components can improve or degrade EVM performance. For example, using inductors with
larger dc resistances lowers efficiency of the solution.
The other members of the TPS6116x IC family have the same footprint. Therefore, the TPS61165 IC may
be replaced on the TPS61165EVM-283 PCB with either the TPS61160 or TPS61161.
NOTE:
When modifying the REV A version of this PCB, it is strongly recommended that you heat
the PCB on a hot plate before using a soldering iron to remove/replace components,
especially the input capacitor and inductor. Otherwise, the expansion when soldering and
contraction when cooling of the wide traces/places connecting these components to the IC
pins can damage the IC. For further explanation and guidance, see the TI application report
QFN/SON PCB Attachment
2
Setup and Test Results
2.1
Input/Output Connections
The connection points are described in the following paragraphs.
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VeriSign is a trademark of VeriSign, Inc.
2
TPS61165EVM-283
SLVU224C – January 2008 – Revised February 2010
Copyright © 2008–2010, Texas Instruments Incorporated