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STANDARD TERMS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques

are

used

to

the

extent

TI

deems

necessary.

TI

does

not

test

all

parameters

of

each

EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3

TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

Содержание TPS51113

Страница 1: ...cedure 6 9 Performance Data and Typical Characteristic Curves 7 10 EVM Assembly Drawing and PCB Layout 10 11 List of Materials 11 12 References 11 13 Revision History 11 Trademarks All trademarks are...

Страница 2: ...enient test points for probing critical waveforms and loop response testing Four layer PCB with 2 oz copper All components on the top layer 5 Electrical Performance Specifications Table 5 1 gives the...

Страница 3: ...on the JP1 to Enable the controller 2 Jumper shorted on JP1 to disable the controller Figure 6 1 TPS51113 EVM Schematic Diagram www ti com Schematic SLUU359A APRIL 2009 REVISED FEBRUARY 2022 Submit D...

Страница 4: ...e used to measure the output ripple voltage Place the oscilloscope probe tip through TP6 and rest the ground barrel on TP8 as shown in Figure 7 1 Using a leaded ground connection may induce additional...

Страница 5: ...N to 10 A maximum Make sure VIN is initially set to 0 V and connected as shown in Figure 7 2 2 Connect a voltmeter V1 at TP1 VIN and TP2 GND to measure the input voltage 7 2 2 Output Connections 1 Con...

Страница 6: ...nnect an output signal amplitude measurement probe channel B to TP3 Connect the ground lead of channel A and channel B to TP9 and TP10 5 Inject around 40 mV or less signal through the isolation transf...

Страница 7: ...26 1 196 1 194 1 200 1 198 IOUT Output Current A V OUT Output Voltage V OUTPUT VOLTAGE vs OUTPUT CURRENT Input Voltage V 14 12 8 Figure 9 2 Load Regulation Figure 9 3 Bode Plot Figure 9 3 shows the bo...

Страница 8: ...ffX X Figure 9 7 Enable Turn OnX X Figure 9 8 Switching Node Performance Data and Typical Characteristic Curves www ti com 8 TPS51113 Buck Controller Evaluation Module User s Guide SLUU359A APRIL 2009...

Страница 9: ...rmance Data and Typical Characteristic Curves SLUU359A APRIL 2009 REVISED FEBRUARY 2022 Submit Document Feedback TPS51113 Buck Controller Evaluation Module User s Guide 9 Copyright 2022 Texas Instrume...

Страница 10: ...ayer Assembly Drawing Top View Figure 10 2 Bottom Assembly Drawing Bottom View Figure 10 3 Top Copper Top View Figure 10 4 Internal Layer 1 Top View Figure 10 5 Internal Layer 2 Top View Figure 10 6 B...

Страница 11: ...R3 R4 R5 3 Resistor Chip 10 k 1 16W 1 0603 STD STD R6 1 Resistor Chip 0 1 16W 1 0603 STD STD R7 1 Resistor Chip 2 74 k 1 16W 1 0603 STD STD R8 R12 2 Resistor Chip 1 1 8W 1 0805 STD STD R9 1 Resistor...

Страница 12: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Страница 13: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Страница 14: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Страница 15: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Страница 16: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Страница 17: ...change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of thes...

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