3 Features of this EVM
The EVM has the following features:
• A TMUX646 in a small BGA (ZEC) package
• 1 power supply decoupling capacitor attached (0.1 µF)
• Additional 0805 pad for additional supply decoupling capacitor.
• Quick prototyping and DC testing of the 36 pin TMUX646 in the BGA (ZEC) package
• All 34 signal paths have test points attached to allow for flexible measurements
• All 30 drain and source pins have 805 pads for differential or single ended loads
• All analog I/O and digital input pins have jumpers that connect to VDD and Ground
• Additional TMUX646ZEC IC pad with SMA pads for 1 differential channel (CLK) and termination resistor pads
for unused channels
4 EVM Images
TMUX646EVM Front and Back with component ID's shown.
Features of this EVM
4
TMUX646EVM User's Guide
SCDU025 – MAY 2021
Copyright © 2021 Texas Instruments Incorporated
