Multicore Fixed and Floating-Point System-on-Chip
Copyright 2012 Texas Instruments Incorporated
C66x CorePac
99
SPRS689D—March 2012
TMS320C6670
For more detailed information on the C66x CorePac in the C6670 device, see the
C66x CorePac User Guide
in
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66
5.1 Memory Architecture
Each CorePac of the TMS320C6670 device contains a 1024KB level-2 memory (L2), a 32KB level-1 program
memory (L1P), and a 32KB level-1 data memory (L1D). The device also contain a 2048KB multicore shared memory
(MSM). All memory on the C6670 has a unique location in the memory map (see Table 2-2
After device reset, L1P and L1D cache are configured as all cache, by default. The L1P and L1D cache can be
reconfigured via software through the L1PMODE field of the L1P Configuration Register (L1PMODE) and the
L1DMODE field of the L1D Configuration Register (L1DCFG) of the C66x CorePac. L1D is a two-way
set-associative cache, while L1P is a direct-mapped cache.
The on-chip bootloader changes the reset configuration for L1P and L1D. For more information, see the
Bootloader
for the C66x DSP User Guide
in
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66
For more information on the operation L1 and L2 caches, see the
C66x DSP Cache User Guide
in
Documentation from Texas Instruments’’ on page 66
5.1.1 L1P Memory
The L1P memory configuration for the C6670 device is as follows:
•
Region 0 size is 0K bytes (disabled)
•
Region 1 size is 32K bytes with no wait states
shows the available SRAM/cache configurations for L1P.
Figure 5-2
L1P Memory Configurations
4
K b
y
tes
8K b
y
tes
16K b
y
tes
L1P Me
m
or
y
00
E
0 0000h
00
E
0
4
000h
00
E
0 6000h
00
E
0 7000h
00
E
0 8000h
D
i
rect
Mapped
Cache
1/2
SRAM
DM
Cache
3/
4
SRAM
7/8
SRAM
A
ll
SRAM
000
001
010
011
100
B
l
oc
k
Base
Address
L1P Mode B
i
ts
4
K b
y
tes
D
i
rect
Mapped
Cache
D
i
rect
Mapped
Cache
Содержание TMS320C6670
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