6.5 Multi-Layer Stackup
Table 6-2. Layer Stackup
Layer
Number
Layer Name
Type
Material
Thickness (mil)
Dielectric Material
Dielectric Constant
Top Overlay
Overlay
Top Solder
Solder Mask/Coverlay
Surface Material
0.4
Solder Resist
3.5
1
Top Layer
Signal
Copper
2.8
Dielectric1
Dielectric
Core
5
FR-4 High Tg
4.8
2
Signal Layer 1
Signal
Copper
2.8
Dielectric3
Dielectric
None
40
FR-4 High Tg
4.8
3
Signal Layer 2
Signal
Copper
2.8
Dielectric2
Dielectric
None
5
FR-4 High Tg
4.8
4
Bottom Layer
Signal
Copper
2.8
Bottom Solder
Solder Mask/Coverlay
Surface Material
0.4
Solder Resist
3.5
Bottom Overlay
Overlay
EVM Documentation
TLVM13660 36-V, 6-A Buck Regulator Evaluation Module User's Guide
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