4.3
Bill of Materials
Schematics, Board Layouts, and Bill of Materials
www.ti.com
Figure 21. HPA358A Bottom Layer Routing
Table 2. HPA357A Bill of Materials
Count
RefDes
Value
Description
Size
Part Number
MFR
3
C1, C6, C7
0.01
µ
F
Capacitor, Ceramic, 50V, X7R, 10%
0603
C1608X7R1H103K
TDK
3
C2, C3, C4
10
µ
F
Capacitor, Ceramic, 25V, X5R, 10%
1206
GRM31CR61E106KA12L
Murata
1
C5
15
µ
F
Capacitor, POSCAP, 25V, 90m
Ω
,
7343(D)
20TQC15M
Sanyo
20%
1
C8
0.1
µ
F
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
0
C9, C10
Open
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
16
D0A–D15A
Q65110A4184
Diode, LED, 20mA, Common Anode
0.118
×
0.134
Q65110A4184
Osram
16
D0B–D15B
LST676-Q1R2-1
Diode. LED, red 12V, 30mA
PLCC-2
LST676-Q1R2-1
Osram
0
D16, D17
Open
Diode, Schottky, 0.5A, 30V
SOD-123
MBR0530T
On Semi
2
J1, J2
PPTC152LJBN-RC
Header, female, 2x15-pin, .100 inch,
0.500 X 1.520 inch
PPTC152LJBN-RC
Sullins
RA
2
Q1, Q4
SI2303CDS
MOSFET, Pch, -30V, 1.64A, 190m
Ω
SOT23
SI2303CDS
Vishay
2
Q3, Q6
Si2302CDS
MOSFET, Nch, 20V, 2.6A, 57m
Ω
SOT23
Si2302CDS
Vishay
28
TLC5944EVM-358
SLVU306 – April 2009