background image

+Vcc2

-Vcc1

GND

GND

+Vcc1

+Vcc2

TP4

DNP

GND

Junc Vocm

GND

GND

-Vcc2

-Vcc1

GND

GND

GND

Vin+

Vin-

VBuf_In

D2S_Out

TP5

DNP

+V_In

-V_In

TP7

DNP

CM_In

TP8

DNP

Vmid_In

TP14

DNP

D2S_Out

GND

0.22

µ

F

C15

DNP

0.22

µ

F

C16

DNP

0.22

µ

F

C19

DNP

0.22

µ

F

C22

0.22

µ

F

C24

49.9

R3

49.9

R4

49.9

R33

49.9

R63

49.9

R16

DNP

10.0k

R8

10.0k

R7

10.0k

R17

10.0k

R5

DNP

10.0k

R6

DNP

10.0

R9

10.0

R10

10.0

R11

1.00k

R13

1.00k

R15

1k

R14

DNP

73.2

R21

0

R22

0

R27

DNP

20k

R24

169

R25

0.01

µ

F

C23

DNP

2.2pF

C26

DNP

11pF

C27

DNP

1.00

R23

DNP

4.02k

R62

DNP

DISABLE

10

GND

7

+IN

2

-IN

3

PAD

17

PATHSEL

4

VIN-

12

+VCC2

16

+VCC1

13

-VCC1

8

-VCC2

5

VIN+

9

VMID_IN

1

VMID_OUT

15

VO1

6

VOUT

11

VREF

14

U1

THS3215IRGVR

Or

THS3217IRGVR

72nH

L8

DNP

0

R1

0

R2

0

R18

0

R19

0

R12

1

2

3

4

5

J3

1

2

3

4

5

J1

1

2

3

4

5

J2

1

2

3

4

5

J5

Uninstall all the RLC filter components if 
not used in the application to prevent 
loading the D2S output

Design Considerations

www.ti.com

6

SBOU161A – February 2016 – Revised April 2016

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

THS3215EVM and THS3217EVM

2.4

Differential to Single-Ended Stage (D2S)

The D2S inputs are driven by an external differential signal through SMA connectors J1 and J2. Standard
lab equipment usually provides only a single-ended output. The

LMH3401

, a very wideband, single-ended

to differential amplifier, was used during product evaluation to drive a differential signal into the D2S. The
spacing of the SMA connectors on the THS321xEVM is designed to interface directly with the output of
the

LMH3401EVM

through standard SMA barrel connectors. The THS321xEVM provides a standard 100-

Ω

differentially-terminated resistive network to GND, dc-coupled to the D2S input pins.

Figure 4

shows the

EVM schematic of the D2S input/output network with the default passive components installed. The output
of the D2S can also be measured externally at J5.

Figure 4. D2S Input Connection Options

Содержание THS3215EVM

Страница 1: ...nd use of the THS3215EVM and THS317EVM THS321xEVM This evaluation module EVM is a demonstration fixture for the THS3215 andTHS3217 family of wideband differential DAC to single ended line drivers The...

Страница 2: ...Supply Schematic 4 2 Logic Control Switches 4 3 Midscale Buffer Configuration Options 5 4 D2S Input Connection Options 6 5 200 MHz Butterworth Filter Before D2S Inputs 7 6 OPS Input and Output Connec...

Страница 3: ...respective product data sheets SBOS780 and SBOS766 1 2 EVM Description The THS321xEVM enables performance evaluation of each individual subblock within these devices The PCB provides various flexible...

Страница 4: ...board through connectors P1 P2 and P3 as shown in Figure 1 Both bipolar and single sided supplies can be used The typical supplies are 6 V CAUTION Supplies beyond 8 1 V can damage the device Figure 1...

Страница 5: ...nstalled by default to achieve the desired offset voltage Resistor R62 must be appropriately sized and resistor R63 uninstalled in order to set the correct voltage at the input of the midscale buffer...

Страница 6: ...t loading the D2S output Design Considerations www ti com 6 SBOU161A February 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated THS3215EVM and THS3217...

Страница 7: ...rmance with similar RLC filter architectures installed on the board Figure 5 200 MHz Butterworth Filter Before D2S Inputs 2 In single supply and ac coupled applications use R18 and R19 to install the...

Страница 8: ...ion 2 4 the OPS can be driven internally or externally The OPS can be also used as a standalone amplifier in an inverting or noninverting configuration The output of the OPS is available at SMA connec...

Страница 9: ...Schematic PCB Layout and Bill of Materials 9 SBOU161A February 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated THS3215EVM and THS3217EVM Figure 7 EV...

Страница 10: ...February 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated THS3215EVM and THS3217EVM 3 2 PCB Layout The PCB layers are shown in Figure 8 through Figur...

Страница 11: ...d Bill of Materials 11 SBOU161A February 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated THS3215EVM and THS3217EVM Figure 10 Layer 3 Power Plane VCC...

Страница 12: ...Materials www ti com 12 SBOU161A February 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated THS3215EVM and THS3217EVM Figure 12 Layer 5 GND Plane Figu...

Страница 13: ...EC Q200 Grade 0 0603 12 R5 R6 R7 R8 R17 R49 6 ERJ 3EKF1002V Panasonic RES 10 0 k 1 0 1 W 0603 13 R9 R10 R11 3 RC0603FR 0710RL Yageo America RES 10 0 1 0 1 W 0603 14 R13 R15 2 ERJ 3EKF1001V Panasonic R...

Страница 14: ...r previous revisions may differ from page numbers in the current version Changes from Original February 2016 to A Revision Page Added THS3215EVM and related information to this user s guide 1 Changed...

Страница 15: ...sponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related inf...

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