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13.2.2.1 Tape Specifications

CC3135MOD

SWRS225D – FEBRUARY 2019 – REVISED MAY 2021

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CC3135MOD

Содержание SimpleLink SWRS225D

Страница 1: ...rity Device identity and key Hardware accelerator cryptographic engines AES DES SHA MD5 CRC File system security encryption authentication access control Initial secure programming Software tamper detection Secure boot Certificate signing request CSR Unique per device key pair Recovery mechanism ability to recover to factory defaults Power Management Subsystem Integrated DC DC converters support a...

Страница 2: ...ash RF filters diplexer crystal and passive components that are fully integrated This generation introduces new capabilities that further simplify the connectivity of things to the Internet The main new features of CC3135MOD include 802 11 a b g n 2 4 GHz and 5 GHz support 2 4 GHz Coexistence with Bluetooth low energy radio Antenna diversity Enhanced security with FIPS 140 2 level 1 validated IC i...

Страница 3: ...it SFlash External SPI Programming 40 MHz 32 768 kHz UART SPI nReset PM 2 3 V to 3 6 V VBAT Aband F D 5 GHz SPDT WRF_A HiB Figure 4 1 CC3135MOD Module Functional Block Diagram www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links CC3135MOD ...

Страница 4: ...Wi Fi Figure 4 2 CC3135 Hardware Overview Figure 4 3 shows an overview of the CC3135 embedded software Host Interface Network Apps TCP IP Stack WLAN Security and Management WLAN MAC and PHY Customer Application SimpleLink Driver APIs Copyright 2017 Texas Instruments Incorporated NetApp BSD Socket Wi Fi Figure 4 3 CC3135 Embedded Software Overview CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 w...

Страница 5: ...Overview 33 9 2 Module Features 33 9 3 Power Management Subsystem 37 9 4 Low Power Operating Modes 37 9 5 Restoring Factory Default Configuration 38 9 6 Hostless Mode 38 9 7 Device Certification and Qualification 39 9 8 Module Markings 41 9 9 End Product Labeling 42 9 10 Manual Information to the End User 42 10 Applications Implementation and Layout 43 10 1 Application Information 43 10 2 PCB Layo...

Страница 6: ...on 9 1 33 Added WPA3 personal and enterprise security to Section 9 1 33 Added WPA3 Personal to list of on chip security accelerators in Section 9 2 1 33 Added WPA3 Enterprise to list of on chip security accelerators in Section 9 2 1 33 Added WPA3 personal to list of Wi Fi security features in Table 9 1 34 Added footnote to Section 9 2 2 34 Added WPA3 personal and enterprise to Table 9 1 34 CC3135M...

Страница 7: ...ynchronous Receiver and Transmitter UART 1 2 2 Serial Port Interface SPI 1 1 1 Multi Channel Audio Serial Port McASP I2S or PCM 2 ch 2 ch Inter Integrated Circuit I2C 1 1 Analog to Digital Converter ADC 4 ch 12 bit 4 ch 12 bit Parallel Interface 8 bit PI 1 1 General Purposes Timers 4 4 Multimedia Card MMC SD 1 1 Security Features Additional Networking Security Unique Device Identity Trusted Root C...

Страница 8: ...e MSP432P401R MCU features the Arm Cortex M4 processor offering ample processing capability with floating point unit and memory footprint for advanced processing algorithm communication protocols as well as application needs while incorporating a 14 bit 1 msps ADC14 that provides a flexible and low power analog with best in class performance to enable developers to add differentiated sensing and m...

Страница 9: ...nCS_IN FLASH_SPI_MISO DIO23 HOST_INTR DIO13 DIO14 HOST_SPI_nCS HOST_SPI_DOUT HOST_SPI_DIN HOST_SPI_CLK nHIB DIO10 GND GND CC3135MOD 57 59 60 63 56 61 58 62 55 26 23 22 21 27 25 24 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 45 48 49 50 44 46 47 51 52 53 54 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 Figure 7 1 shows the approximate location of pins on the module Figure 7 1 CC3135MOD Pin...

Страница 10: ...N NO DESCRIPTION HOSTLESS MODE BLE COEX CC_COEX_ OUT CC_COEX_ IN 1 GND N A N A N A Power GND 2 GND N A N A N A Power GND 3 DIO10 Y Y Y I O 1 Digital input or output 4 nHIB Hi Z I 2 Hibernate signal input to the NWP subsystem active low This is connected to the MCU GPIO If the GPIO from the MCU can float while the MCU enters low power consider adding a pullup resistor on the board to avoid floating...

Страница 11: ... Z O 21 A 100 kΩ pull down resistor is internally tied to this SOP pin 24 SOP1 N A N A N A Hi Z 34 A 100 kΩ pull down resistor is internally tied to this SOP pin SOP 2 0 used for factory restore See Section 9 5 25 GND N A N A N A Power GND 26 GND N A N A N A Power GND 27 GND N A N A N A Power GND 28 GND N A N A N A Power GND 29 GND N A N A N A Power GND 30 GND N A N A N A Power GND 31 RF_ABG N A N...

Страница 12: ... A N A Hi Z 39 Power supply for the module must be connected to battery 2 3 V to 3 6 V 38 GND N A N A N A Power GND 39 NC N A N A N A No Connect 40 VBAT2 N A N A N A Hi Z 10 44 54 Power supply for the module must be connected to battery 2 3 V to 3 6 V 41 NC N A N A N A No Connect 42 DIO30 Y Y Y Hi Z 53 Network Scripter I O 43 GND N A N A N A Power GND 44 UART1_nRTS Hi Z O 50 UART interface to host...

Страница 13: ... MODE BLE COEX CC_COEX_ OUT CC_COEX_ IN 53 DIO8 Y Y Y Hi Z 63 Digital input or output 54 DIO9 Y Y Y Hi Z 64 Digital input or output 1 I input O output RF radio frequency I O bidirectional 2 Output Only www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links CC3135MOD ...

Страница 14: ...nd outputs DIO12 9 I O I O DIO13 10 I O I O DIO23 12 I O I O DIO24 18 I O I O DIO28 19 1 I O I O DIO29 22 I O I O DIO30 42 1 I O I O DIO3 48 I O I O DIO4 49 I O I O DIO5 50 I O I O DIO8 53 I O I O DIO9 54 I O I O Hostless Mode DIO10 3 I O I O Hostless mode inputs and outputs DIO12 9 I O I O DIO13 10 I O I O DIO23 12 I O I O DIO24 18 I O I O DIO28 19 1 I O I O DIO29 22 I O I O DIO25 23 O O DIO30 42...

Страница 15: ...e on power 1 SOP0 34 I I Configuration sense on power 0 Power VBAT1 37 Power supply for the module VBAT2 40 Power supply for the module nHIB nHIB 4 I I Hibernate signal input to the NWP subsystem active low RF RF_ABG 31 I O I O WLAN analog RF 802 11 a b g n bands Test Port TEST_58 48 O O Test Signal TEST_59 49 I I Test Signal TEST_60 50 O O Test Signal TEST_62 52 O O Test Signal 1 LPDS retention u...

Страница 16: ...the SOP lines An external 10 kΩ pull up resistor is required for factory restore See Section 9 5 Reset RESET input for the device 35 36 There is an internal 100 kΩ pull up resistor option from the nRESET pin to VBAT_RESET Note VBAT_RESET is not connected to VBAT1 or VBAT2 within the module The following connection schemes are recommended Connect nRESET to a GPIO from the host only if nRESET will b...

Страница 17: ...E UNIT VESD Electrostatic discharge ESD performance Human body model HBM per ANSI ESDA JEDEC JS001 1 2000 V Charged device model CDM per JESD22 C101 2 All pins 500 1 JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process 2 JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process 8 3 Recommended Oper...

Страница 18: ...ee CC31XX CC32XX SimpleLink Wi Fi and IoT Network Processor Programmer s Guide 8 5 Current Consumption Summary 5 GHz RF Band TA 25 C VBAT 3 6 V PARAMETER TEST CONDITIONS 1 2 MIN TYP MAX UNIT TX 6 OFDM 318 mA 54 OFDM 293 RX 3 54 OFDM 61 mA Idle connected 4 690 µA LPDS 115 µA Hibernate 5 5 µA Shutdown 1 µA Peak calibration current 5 3 VBAT 3 6 V 290 mA VBAT 3 3 V 310 VBAT 2 7 V 310 VBAT 2 3 V 365 1 ...

Страница 19: ...4 OFDM respectively 4 In Figure 8 1 the area enclosed in the circle represents a significant reduction in current during transition from TX power level 3 to level 4 In the case of lower range requirements 14 dBm output power TI recommends using TX power level 4 to reduce the current Figure 8 1 TX Power and IBAT vs TX Power Level Settings 1 DSSS 1 The back off range is between 6 dB to 6 dB in 0 25 ...

Страница 20: ...l Settings 6 OFDM Figure 8 3 TX Power and IBAT vs TX Power Level Settings 54 OFDM CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 www ti com 20 Submit Document Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links CC3135MOD ...

Страница 21: ...31xx CC32xx SimpleLink Wi Fi and Internet on a chip Solution ImageCreator and Programming Tool User s Guide 5 The maximum transmit power range is 18 dBm to 0 125 dBm in 0 125 dBm decrements 6 FCC IC ISED ETSI CE and MIC are supported 7 Rates are grouped into high modulation rates MCS7 54 OFDM and 48 OFDM and lower modulation rates all other rates 8 The back off range is 0 dBm to 18 dBm in 0 125 dB...

Страница 22: ... four contacts for a 2 AA battery and the wiring and PCB routing resistance Note When the device is in the Hibernate state brownout is not detected only blackout is in effect during the Hibernate state Figure 8 4 Brownout and Blackout Levels 1 of 2 Figure 8 5 Brownout and Blackout Levels 2 of 2 In the brownout condition all sections of the CC3135MOD including the 32 kHz RTC shut down except for th...

Страница 23: ...l output voltage IL 2 mA configured I O drive strength 2 mA 2 4 V VDD 3 6 V VDD 0 2 V IL 4 mA configured I O drive strength 4 mA 2 4 V VDD 3 6 V VDD 0 2 V IL 8 mA configured I O drive strength 8 mA 2 4 V VDD 3 6 V VDD 0 2 V IL 2 mA configured I O drive strength 2 mA 2 3 V VDD 2 4 V VDD 0 25 V IOH High level source current 2 mA drive 2 mA 4 mA drive 4 6 mA drive 6 IOL Low level sink current 2 mA dr...

Страница 24: ...el 10 PER 802 11b 2 5 dBm 802 11g 8 5 1 Sensitivity is 1 dB worse on channel 13 2472 MHz 2 Sensitivity for mixed mode is 1 dB worse Table 8 3 WLAN Receiver Characteristics 5 GHz Band TA 25 C VBAT 2 3 V to 3 6 V PARAMETER TEST CONDITIONS Mbps MIN TYP MAX UNIT Sensitivity 10 PER for 11g 11n rates 6 OFDM 89 dBm 9 OFDM 88 18 OFDM 85 36 OFDM 78 5 54 OFDM 72 MCS7 GF 1 68 Maximum input level 802 11a 17 d...

Страница 25: ...n Table 8 5 WLAN Transmitter Characteristics 5 GHz Band TA 25 C VBAT 2 3 V to 3 6 V 1 Parameters measured at SoC pin are the average of channels 40 56 120 and 157 2 3 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Operating frequency range 4 5 6 5180 5825 MHz Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM 6 OFDM 15 1 dBm 9 OFDM 15 1 18 OFDM 15 1 36 OFDM 13 6 54 OFDM 12 MCS7 1...

Страница 26: ... Junction to board 8 0 N A T3 RΘJA Junction to free air 19 1 0 T4 Junction to moving air 14 7 1 T5 13 4 2 T6 12 5 3 T7 ΨJT Junction to free air 5 4 0 T8 Junction to package top 5 8 1 T9 6 1 2 T10 6 5 3 T11 ΨJB Junction to free air 6 8 0 T12 Junction to board 6 6 1 T13 6 6 2 T14 6 5 3 1 C W degrees Celsius per watt 2 These values are based on a JEDEC defined 2S2P system with the exception of the Th...

Страница 27: ...e stable 1 ms T2 Hardware wake up time 25 ms T3 Initialization time Internal 32 kHz XTAL settling plus firmware initialization time plus radio calibration 1 35 s 8 15 2 Power Down Sequencing For proper power down of the CC3135MOD module ensure that the nRESET pin 35 and nHIB pin 4 pins have remained in a known state for a minimum of 200 ms before removing power from the module 8 15 3 Device Reset ...

Страница 28: ... 8 8 nHIB Timing Requirements ITEM NAME DESCRIPTION MIN TYP MAX UNIT Thib_min Minimum hibernate time Minimum pulse width of nHIB being low 1 10 ms Twake_from_hib Hardware wakeup time plus firmware initialization time See 2 50 ms 1 If temperature changes by more than 20 C initialization time from HIB can increase by 200 ms due to radio calibration 2 Ensure that the nHIB pulse width is kept above th...

Страница 29: ...gure 8 8 SPI Host Interface Table 8 9 lists the SPI host interface pins Table 8 9 SPI Host Interface PIN NAME DESCRIPTION HOST_SPI_CLK Clock up to 20 MHz from MCU host to CC3135MOD module HOST_SPI_nCS CS active low signal from MCU host to CC3135MOD module HOST_SPI_MOSI Data from MCU host to CC3135MOD module HOST_INTR Interrupt from CC3135MOD module to MCU host HOST_SPI_MISO Data from CC3135MOD mod...

Страница 30: ... RTS Parity None Stop bits 1 Bit order Least significant bit LSB first Host interrupt polarity Active high Host interrupt mode Rising edge or level 1 Endianness Little endian only 1 1 The SimpleLink device does not support automatic detection of the host length while using the UART interface 8 16 2 1 5 Wire UART Topology Figure 8 10 shows the typical 5 wire UART topology comprised of four standard...

Страница 31: ...ST_INTR IRQ Figure 8 12 3 Wire UART Topology Using 3 wire topology requires one of the following conditions to be met Host always stays awake or active Host goes to sleep but the UART module has receiver start edge detection for auto wake up and does not lose data Host can always receive any amount of data transmitted by the SimpleLink device because there is no flow control in this direction Beca...

Страница 32: ...external Flash interface pins 13 14 15 and 17 Note that during normal operation the external Flash interface should remain unconnected For timing details see the MX25R3235F data sheet CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 www ti com 32 Submit Document Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links CC3135MOD ...

Страница 33: ...le profiles stored in a serial Flash allows automatic fast connection to an access point without user or host intervention Supports all common Wi Fi security modes for personal and enterprise networks with on chip security accelerators including WEP WPA WPA2 PSK WPA2 Enterprise 802 1x WPA3 Personal and WPA3 Enterprise Smart provisioning options deeply integrated within the device provide a compreh...

Страница 34: ...access point the CC3135 device provides critical information such as device name IP vendor and port number DHCP server Ping Table 9 1 summarizes the NWP features Table 9 1 NWP Features Feature Description Wi Fi standards 802 11a b g n station 802 11a b g AP supporting up to four stations Wi Fi Direct client and group owner Wi Fi channels 2 4 GHz ISM and 5 GHz U NII Channels Channel Bandwidth 20 MH...

Страница 35: ...pleLink Wi Fi CC3135MOD internet on a chip module enhances the security capabilities available for development of IoT devices while completely offloading these activities from the MCU to the networking subsystem The security capabilities include the following key features Wi Fi and Internet security Personal and enterprise Wi Fi security Personal standards AES WPA2 PSK TKIP WPA PSK WEP Enterprise ...

Страница 36: ...LS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256 SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256 Server authentication Client authentication Domain name verification Socket upgrade to secure socket STARTTLS Secure HTTP server HTTPS The trusted root certificate catalog verifies that the CA used by the application is trusted and known secure content delivery The TI root of trust public key is a hard...

Страница 37: ...attery connection the module can be directly connected to two AA alkaline batteries All other voltages required to operate the device are generated internally by the DC DC converters This scheme is the most common mode for the device because it supports wide voltage operation from 2 3 to 3 6 V 9 4 Low Power Operating Modes This section describes the low power modes supported by the module to optim...

Страница 38: ... style conditioning can include anything from GPIO toggling to transmitting packets The conditional scripting abilities can be divided into conditions and actions The conditions define when to trigger actions Only one action can be defined per condition but multiple instances of the same condition may be used so in effect multiple actions can be defined for a single condition In total 16 condition...

Страница 39: ... 451I CC3135MOD ETSI CE Europe EN300328 v2 2 1 2 4 GHz Wi Fi EN301893 v2 1 1 5GHz Wi Fi EN62311 2008 MPE EN301489 1 v2 2 1 EMC General EN301489 17 v3 2 0 EMC Wi Fi EN60950 1 2006 A11 2009 A1 2010 A12 2011 A2 2013 MIC Japan Article 49 20 of ORRE 201 190034 9 7 1 FCC Certification and Statement CAUTION FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set...

Страница 40: ...e Le présent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autorisée aux deus conditions suivantes L appareil ne doit pas produire de brouillage L utilisateur de l appareil doit accepter tout brouillage radioélectrique subi même si le brouillage ests susceptible d en compromettre lu fonctionnement 9 7 3 ETSI CE Certification ...

Страница 41: ...MODRNMMOB Model YMWLLLC LTC Lot Trace Code Y Year M Month WLLLC Reserved for internal use Z64 CC3135MOD FCC ID single modular FCC grant ID 451I CC3135MOD IC single modular IC grant ID MIC compliance mark R 201 190034 MIC ID modular MIC grant ID CE CE compliance mark www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback 4...

Страница 42: ... host system using this module must display a visible label indicating the following text Contains transmitter module with certificate number 201 190034 9 10 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user...

Страница 43: ... 2 4 GHz band without mutual interference The following coexistence modes can be configured by the user Off mode or intrinsic mode No BLE 2 4 GHz radio coexistence or no synchronization between WLAN and Bluetooth low energy in case Bluetooth low energy exists in this mode collisions can randomly occur Time Division Multiplexing TDM Dual Antenna Dual band Wi Fi see Figure 10 1 In this mode the WLAN...

Страница 44: ... this implementation only a single GPIO from the BLE device to the CC3135MOD device is required The Antenna switch 14is controlled by 2 GPIO lines from the CC3135MOD device Table 7 2 lists which GPIOs can be used for Antenna Selection BLE CCxxxx WLAN CC3135MOD RF CC_COEX_BLE_IN RF_ABG Coex IO Antenna Selection SPDT RF Switch ANT_SEL_1 ANT_SEL_2 Dual Band Ant 1 Dual Band Ant 2 BLE Ant Figure 10 2 C...

Страница 45: ...B line does not float at any time 3 3pF C3 DIO13 10 GND 2 GND 1 GND 16 GND 27 GND 28 GND 30 GND 32 GND 38 GND 43 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 GND 61 GND 62 GND 63 HOST_INTR 11 HOST_SPI_CLK 5 HOST_SPI_DIN 6 HOST_SPI_DOUT 7 HOST_SPI_CS 8 FLASH_SPI_MISO 13 FLASH_SPI_CS_IN 14 NC 33 FLASH_SPI_CLK 15 NC 41 DIO30 42 DIO10 3 NC 45 DIO8 53 DIO9 54 FLASH_SPI_M OSI 17 DIO24 18 NC 20 DIO29 22 GND...

Страница 46: ...1D Capacitor ceramic 0 1 uF 10 V 10 X5R 0402 1 C3 3 3 pF Murata GJM1555C1H3R3BB01 Capacitor ceramic 3 3 pF 50 V 0 1pF C0G NP0 0402 2 C4 C5 100 uF Murata LMK325ABJ107MMHT Capacitor ceramic 100 uF 10 V 20 X5R AEC Q200 Grade 3 1210 1 E1 2 4 GHz 5 GHz Ant Ethertronics M830520 Antenna Bluetooth WLAN Zigbee 1 L1 3 nH Murata LQG15HS3N0S02D Inductor Unshielded Multilayer 3nH 0 8 A 0 125 Ω SMD 1 R1 10k Vis...

Страница 47: ...n the following subsections to preserve minimize the risk with regulatory certifications for FCC IC ISED ETSI CE and MIC Moreover TI recommends customers follow the guidelines described in this section to achieve similar performance to that obtained with the TI reference design 10 2 1 General Layout Recommendations Ensure that the following general layout recommendations are followed Have a solid ...

Страница 48: ...erformance from the device A poor layout can cause low output power EVM degradation sensitivity degradation and mask violations Figure 10 4 shows the RF placement and routing of the CC3135MOD module Figure 10 4 RF Section Layout CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 www ti com 48 Submit Document Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links CC3135MOD ...

Страница 49: ... under the RF BG pin pin 31 is as shown in Figure 10 5 Figure 10 5 Top Layer Copper Pull Back on RF Pads www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback 49 Product Folder Links CC3135MOD ...

Страница 50: ...Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance 5 Ensure that the antenna impedance is 50 Ω because the device is rated to work only with a 50 Ω system 6 In case of printed antenna ensure that the simulation is performed with the solder mask in consideration 7 Ensure that the antenna has a near omni directional pattern 8 The feed point of ...

Страница 51: ...ng GND vias along the line also provides additional shielding Figure 10 6 shows a cross section of the coplanar waveguide with the critical dimensions Figure 10 7 shows the top view of the coplanar waveguide with GND and via stitching Figure 10 6 Coplanar Waveguide Cross Section S W Figure 10 7 CPW With GND and Via Stitching Top View www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Cop...

Страница 52: ...AMETER VALUE UNIT W 26 mils S 5 5 mils H 42 1 mils Er FR 4 substrate 4 2 F m Table 10 5 Recommended PCB Values for 4 Layer Board L1 to L2 16 mils PARAMETER VALUE UNITS W 21 mils S 10 mils H 16 mils Er FR 4 substrate 4 5 F m CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 www ti com 52 Submit Document Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links CC3135MOD ...

Страница 53: ...r to obtain better solder balancing and solder joint reliability PCB land pattern are 1 1 to module soldering pad dimension Thermal vias on PCB connected to other metal plane are for thermal dissipation purpose It is critical to have sufficient thermal vias to avoid device thermal shutdown Recommended vias size are 0 2mm and position not directly under solder paste to avoid solder dripping into th...

Страница 54: ...n After surface mount assembly transmission X ray should be used for sample monitoring of the solder attachment process This identifies defects such as solder bridging shorts opens and voids It is also recommended to use side view inspection in addition to X rays to determine if there are Hour Glass shaped solder and package tilting existing The Hour Glass solder shape is not a reliable joint 90 m...

Страница 55: ...R 1 Peak temperature range 235 to 240 C typical 260 C maximum Pre heat soaking 150 to 200 C 60 to 120 seconds Time above melting point 60 to 90 seconds Time with 5 C to peak 30 seconds maximum Ramp up 3 C second Ramp down 6 C second 1 For details refer to the solder paste manufacturer s recommendation Note TI does not recommend the use of conformal coating or similar material on the SimpleLink mod...

Страница 56: ...ecommendation for Wi Fi provisioning using SimpleLink Wi Fi products The provisioning release implements advanced AP mode and SmartConfig technology provisioning with feedback and fallback options to ensure successful process has been accomplished Customers can use both embedded library and the mobile library for integration to their end products SimpleLink Wi Fi CC3135 SDK Plugin The CC3135 SDK c...

Страница 57: ...more For more information on CC31xx devices visit http www ti com simplelinkwifi www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback 57 Product Folder Links CC3135MOD ...

Страница 58: ... processor related peripherals and other technical collateral follows The following documents provide support for the CC3135MOD module Application Reports Transfer of TI s Wi Fi Alliance Certifications to Products Based on SimpleLink This document explains how to employ the Wi Fi Alliance WFA derivative certification transfer policy to transfer a WFA certification already obtained by Texas Instrum...

Страница 59: ...visioning APIs required for building the mobile application SimpleLink Wi Fi and Internet on a chip CC3135 and CC3235 Solution Radio Tool The Radio Tool serves as a control panel for direct access to the radio and can be used for both the radio frequency RF evaluation and for certification purposes This guide describes how to have the tool work seamlessly on Texas Instruments evaluation platforms ...

Страница 60: ...f any or any direct product of such technology to any destination to which such export or re export is restricted or prohibited by U S or other applicable laws without obtaining prior authorization from U S Department of Commerce and other competent Government authorities to the extent required by those laws 12 8 Glossary TI Glossary This glossary lists and explains terms acronyms and definitions ...

Страница 61: ...ht of the module is 2 4 mm The weight of the module is 1 8g typical Note 1 All dimensions are in mm 2 Solder mask should be the same or 5 larger than the dimension of the pad 3 Solder paste must be the same as the pin for all peripheral pads For ground pins make the solder paste 20 smaller than the pad 13 2 Package Option Addendum The CC3135MOD is only offered in a 750 unit reel www ti com CC3135M...

Страница 62: ...therwise considered Pb Free RoHS compatible as defined above Green RoHS no Sb Br TI defines Green to mean Pb Free RoHS compatible and free of Bromine Br and Antimony Sb based flame retardants Br or Sb do not exceed 0 1 by weight in homogeneous material space 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature sp...

Страница 63: ... Reel Information Surface resistance Vendor No Spec www ti com CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback 63 Product Folder Links CC3135MOD ...

Страница 64: ...13 2 2 1 Tape Specifications CC3135MOD SWRS225D FEBRUARY 2019 REVISED MAY 2021 www ti com 64 Submit Document Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links CC3135MOD ...

Страница 65: ...16 28 43 QFM 2 4 mm max height MOB0063A QUAD FLAT MODULE 4221462 D 06 2019 NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change without notice AREA PIN 1 INDEX 0 1 X1 45 PIN 1 ID 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 0 15 C A B 0 05 C 56 59 62 SCALE 0 650 ...

Страница 66: ... 2019 NOTES continued 3 This package is designed to be soldered to a thermal pad on the board For more information see Texas Instruments literature number SLUA271 www ti com lit slua271 LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE 6X PKG PKG SEE DETAIL 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 METAL UNDER SOLDER MASK SOLDER MASK OPENING 9X 45 X 1 56 59 62 SOLDER MASK OPENING METAL UNDE...

Страница 67: ...ued 4 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC 7525 may have alternate design recommendations PKG PKG 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 SOLDER PASTE EXAMPLE BASED ON 0 125 mm THICK STENCIL EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA PAD 55 77 5 PADS 56 63 79 SCALE 6X SEE DETAILS 56 59 62 SOLDER MASK EDGE SOLDER MASK ED...

Страница 68: ...o change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for and you will fully indemn...

Страница 69: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Texas Instruments CC3135MODRNMMOBR ...

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