3 Getting Started
This section provides information regarding PGA2505EVMV2 handling and unpacking, as well as the absolute
operating conditions.
3.1 Electrostatic Discharge Caution
CAUTION
Many of the components on the PGA2505EVMV2 are susceptible to damage by electrostatic
discharge (ESD). Customers are advised to observe proper ESD handling precautions when
unpacking and handling the EVM. Failure to observe ESD handling procedures may result in
damage to the EVM components.
3.2 Unpacking the EVM
In addition to the PGA2505EVMV2 evaluation module board, order and unpack the MSP-EXP430F5529LP,
MSP430F5529 USB LaunchPad development kit
. Plug in the MSP430
™
microcontroller on top of the
PGA2505EVMV2, as shown in
.
Figure 3-1. PGA2505EVMV2 With MSP430™ Microcontroller Connected
Getting Started
SBOU259 – OCTOBER 2021
PGA2505EVMV2 Evaluation Module
7
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