NOTES:
1.
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2.
This drawing is subject to change without notice.
3.
The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
PACKAGE OUTLINE
4219044/A 05/2018
www.ti.com
VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
RGZ0048A
A
0.08 C
0.1
C A B
0.05
C
B
SYMM
SYMM
PIN 1 INDEX AREA
7.1
6.9
7.1
6.9
1 MAX
0.05
0.00
SEATING PLANE
C
5.15±0.1
2X 5.5
2X
5.5
44X 0.5
48X
0.5
0.3
48X
0.30
0.18
PIN1 ID
(OPTIONAL)
(0.2) TYP
1
12
13
24
25
36
37
48
Содержание MSP430F4132IPM
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