Schematic, PCB Layout, and Bill of Materials
19
SLAU778A – June 2018 – Revised December 2018
Copyright © 2018, Texas Instruments Incorporated
DAC81408EVM
4.3
Bill of Materials
lists the bill of materials (BOM).
Table 9. DAC81408 EVM Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
!PCB
1
Printed Circuit Board
DC051
Any
@H1, @H2, @H3, @H4
4
Hex Standoff, #4-40,
Aluminum, 1/4"
1/4 inch Aluminum Hex
Standoff
1891
Keystone
C1, C4, C5, C10, C12,
C14, C15
7
1uF
CAP, CERM, 1 uF, 16 V,
+/- 10%, X5R, 0603
0603
C0603C105K4PACTU
Kemet
C2, C3, C13
3
0.1uF
CAP, CERM, 0.1 uF, 16
V, +/- 5%, X7R, 0603
0603
C0603C104J4RACTU
Kemet
C6, C11, C18
3
10uF
CAP, CERM, 10 uF, 35
V, +/- 10%, X6S, 0805
0805
GRM21BC8YA106KE11L MuRata
C7, C8
2
10uF
CAP, CERM, 10 uF, 50
V, +/- 10%, X7R, AEC-
Q200 Grade 1, 1210
1210
UMJ325KB7106KMHT
Taiyo Yuden
C9
1
1000pF
CAP, CERM, 1000 pF,
50 V, +/- 10%, X7R,
0603
0603
C0603C102K5RACTU
Kemet
C16, C17, C19
3
1uF
CAP, CERM, 1 uF, 25 V,
+/- 10%, X5R, 0603
0603
C1608X5R1E105K080A
C
TDK
H1, H2, H3, H4
4
Screw Pan Head M3
Screw M3
29311
Keystone
J1
1
Header, 100mil, 16x2,
Tin, SMT
16x2 Header
TSM-116-01-T-DV-P
Samtec
J2, J3, J9
3
Header, 100mil, 2x1,
Gold with Tin Tail, SMT
2x1 Header
TSM-102-01-L-SV
Samtec
J7
1
TERM BLOCK, 7POS,
3.5MM, TH
24.5x9.2x7.6mm
1984662
Phoenix Contact
J8
1
Header(Shrouded),
2.54mm, 5x2, Gold, TH
Header, 2.54mm, 5x2,
TH
AWHW-10G-0202-T
Assman WSW
J10, J11, J12
3
Header, 2.54mm, 3x1,
Gold, SMT
Header, 2.54mm, 3x1,
SMT
TSM-103-01-L-SV-P-TR
Samtec
L1, L2
2
600 ohm
Ferrite Bead, 600 ohm @
100 MHz, 1 A, 0603
0603
742792651
Wurth Elektronik
LBL1
1
Thermal Transfer
Printable Labels, 0.650"
W x 0.200" H - 10,000
per roll
PCB Label 0.650 x 0.200
inch
THT-14-423-10
Brady
R1, R2, R12, R13, R14,
R15, R16, R17
8
10.0k
RES, 10.0 k, 1%, 0.1 W,
0603
0603
RC0603FR-0710KL
Yageo America