Texas Instruments CC3000, Руководство пользователя

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SWRU331-009
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Bill of Materials (BOM)
2.6 Bill of Materials (BOM)
2.6.1 PCB Design Guidelines
The recommendations in this document are based on a two-layer PCB with the CC3000 module. The PCB
is built using standard FR4 material. Both layers are used for signal routing. TI recommends keeping the
traces of the SPI signals as short as possible.
Table 2-8 shows the PCB stack-up data.
Table 2-8. PCB Stack-Up Data
PCB Stack Up Impedance
Layer Type Thickness Single end Theory value
Top side solder mask 0.50 mil
Trace 20 space 5,
L1 Top plating 1.82 mil 47.57
50 Ω ±10%
Prepreg 52.20 mil mil
L2 plating 1.82 mil mil
Bottom side solder mask 0.50 mil
56.84 mil
TOTAL
1.44 mm
2.6.2 RF Trace
Figure 2-9 shows a 50- Ω trace design recommended for the PCB layout.
Figure 2-9. Trace Design for PCB Layout
15 SWRU331A – November 2012 – Revised August 2014 CC3000 BoosterPack EVM Board
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