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Texas Instruments bq25606 Скачать руководство пользователя страница 13

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Revision History

13

SLUUBL3A – June 2017 – Revised October 2017

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Copyright © 2017, Texas Instruments Incorporated

Revision History

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from June 2, 2017 to September 30, 2017

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Содержание bq25606

Страница 1: ...6 evaluation module unless otherwise noted Contents 1 Introduction 2 1 1 EVM Features 2 1 2 I O Descriptions 2 2 Test Summary 3 2 1 Equipment 3 2 2 Equipment Setup 3 2 3 Test Procedure 5 3 PCB Layout Guideline 6 4 Board Layout 7 5 Schematic 9 6 Bill of Materials 10 List of Figures 1 Original Test Setup for bq25606 EVM 4 2 bq25606EVM Top Overlay 7 3 bq25606EVM Top Solder Mask 7 4 bq25606EVM Top Lay...

Страница 2: ...round J5 BATSNS_ICHG BATSNS or ICHG pin connection J5 BAT Connected to battery pack positive node J5 GND Ground J6 I2C 4 pin connector J7 USB TO GPIO connector Not populated Table 3 lists the EVM jumper connections Table 3 EVM Jumper Connections and Shunt Installation Jack Description bq25606 Setting JP1 PSEL pin selection Not installed JP2 CE pin setting pull low to enable the charge Installed JP...

Страница 3: ...upply constant voltage 4 5 V A 0 20 V 0 5 A 30 W system DC electronic load and setting as constant voltage load mode or Kepco load BOP 20 5M DC 0 to 20 V 0 to 5 A or higher 3 Load 2 Use with Boost Mode VAC to GND load 10 Ω 5 W or greater 4 Meters Six Fluke 75 multimeters equivalent or better or Four equivalent voltage meters and two equivalent current meters The current meters must be capable of m...

Страница 4: ...LUUBL3A June 2017 Revised October 2017 Submit Documentation Feedback Copyright 2017 Texas Instruments Incorporated bq25606 PWR772 Evaluation Module 6 Install shunts as shown in Table 3 Figure 1 Original Test Setup for bq25606 EVM ...

Страница 5: ...urrent depending on the voltage sensed at its VBUS pin using the VINDPM feature BAT pin as part of normal termination and TS pin through its battery temperature monitoring feature via battery thermistor Therefore voltmeters must be used to measure the voltage as close to the IC pins as possible instead of relying on the digital readouts of the power supply If a battery thermistor is not available ...

Страница 6: ...ther trace or plane 3 Put an output capacitor near to the inductor and the IC Tie ground connections to the IC ground with a short copper trace connection or GND plane 4 Route analog ground separately from the power ground Connect analog ground and connect power ground separately Connect analog ground and power ground together using a power pad as the single ground connection point or use a 0 Ω re...

Страница 7: ...edback Copyright 2017 Texas Instruments Incorporated bq25606 PWR772 Evaluation Module 4 Board Layout Figure 2 through Figure 9 show the EVM PCB layout images Figure 2 bq25606EVM Top Overlay Figure 3 bq25606EVM Top Solder Mask Figure 4 bq25606EVM Top Layer Figure 5 bq25606EVM Signal Layer 1 ...

Страница 8: ...ber 2017 Submit Documentation Feedback Copyright 2017 Texas Instruments Incorporated bq25606 PWR772 Evaluation Module Figure 6 bq25606EVM Signal Layer 2 Figure 7 bq25606EVM Bottom Layer Figure 8 bq25606EVM Bottom Solder Mask Figure 9 bq25606EVM Bottom Overlay ...

Страница 9: ...14 DNP NT1 Net Tie 0 R16 DNP Green D4 REGN RTOP TS PSEL GND REGN CE GND GND OTG TP9 TP8 SYS BAT BAT SYS TP5 REGN BATSNS_ICHG INT_ILIM SCL_OTG TP10 TP11 TS TS TP12 DNP TP13 D _ PG TP14 TP15 QON_VSET D _PSEL TP16 CE TP17 TP18 TP19 TP20 AGND PGND BAT SYS PULLUP AGND 10k ohm R11 PULL UP 1 2 3 4 5 SW3 DNP 1 2 3 4 5 SW4 DNP 1 2 3 4 5 SW2 DNP BAT SYS SW PMID JP13 SCL_OTG 1 2 3 JP9 AGND QON_VSET 1µF C15 0...

Страница 10: ... Header 22 05 3041 Molex JP1 JP4 JP9 3 Header 100 mil 3 1 Tin TH Header 3 PIN 100 mil Tin PEC03SAAN Sullins Connector Solutions JP2 JP3 JP5 JP6 JP7 JP10 JP12 JP13 JP14 9 Header 100 mil 2 1 Tin TH Header 2 PIN 100 mil Tin PEC02SAAN Sullins Connector Solutions L2 1 1 µH Inductor 1 µH 3 2 A 0 028 Ω SMD 2 5 2 mm MPIM252010F1R0M LF Microgate LBL1 1 Thermal Transfer Printable Labels 0 650 W 0 200 H 10 0...

Страница 11: ...35 V 10 X5R 0603 0603 GMK107BJ105KA T Taiyo Yuden C19 0 10 µF Capacitor ceramic 10 µF 10 V 10 X7R 0805 0805 GRM21BR71A106KE51L Murata D1 0 13 V Diode TVS Uni 13 V W SOD 123W SOD 123W PTVS13VS1UR 115 NXP Semiconductor D2 D7 0 40 V Diode Schottky 40 V 0 38 A SOD 523 SOD 523 ZLLS350TA Diodes Inc D3 D6 0 20 V Diode Schottky 20 V 1 A 152AD 152AD NSR10F20NXT5G ON Semiconductor FID1 FID2 FID3 FID4 FID5 F...

Страница 12: ...ue Description Package Reference Part Number Manufacturer Alternate Part Number Alternate Manufacturer SH JP1 SH JP5 SH JP8 SH JP9 SH JP11 SH JP15 SH JP16 SH JP17 SH JP18 0 1 2 Shunt 100 mil Gold plated Black Shunt 969102 0000 DA 3M SNT 100 BK G Samtec SW1 SW2 SW3 SW4 0 Compact Probe Tip Circuit Board Test Points TH 25 per TH Scope Probe 131 5031 00 Tektronix TP12 0 Test Point Miniature White TH W...

Страница 13: ...back Copyright 2017 Texas Instruments Incorporated Revision History Revision History NOTE Page numbers for previous revisions may differ from page numbers in the current version Changes from June 2 2017 to September 30 2017 Page Changed Schematic for bq25606EVM 772 9 Changed bq25606EVM 772 BOM 10 ...

Страница 14: ... TI Resource NO OTHER LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN including but not limited to any patent right copyright mask work right or other intellectual property right relating to any combination machine or process in which TI product...

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