User’s Guide
BQ25306 (BMS005) Evaluation Module
ABSTRACT
This user's guide provides detailed testing instructions for the BQ25306 evaluation module (EVM). Also included
are descriptions of the necessary equipment, equipment setup, procedures, the printed-circuit board layouts,
schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations
EVM
,
BQ25306EVM, BMS005
, BMS005-004 and the term
evaluation module
are synonymous with the BQ25306 evaluation module, unless otherwise noted.
Table of Contents
1 Introduction
.............................................................................................................................................................................
2
1.1 Features.............................................................................................................................................................................
2
1.2 I/O Descriptions..................................................................................................................................................................
2
2 Test Setup and Results
..........................................................................................................................................................
3
2.1 Equipment..........................................................................................................................................................................
3
2.2 Equipment Setup................................................................................................................................................................
3
2.3 Test Procedure...................................................................................................................................................................
4
3 PCB Layout Guideline
............................................................................................................................................................
5
4 Board Layout, Schematic, and Bill of Materials
...................................................................................................................
6
4.1 Board Layout......................................................................................................................................................................
6
4.2 Schematic..........................................................................................................................................................................
9
4.3 Bill of Materials.................................................................................................................................................................
10
5 Revision History
...................................................................................................................................................................
13
List of Figures
Figure 2-1. Original Test Setup for BMS005-004.........................................................................................................................
3
Figure 2-2. BQ25306EVM 1-Cell Efficiency.................................................................................................................................
5
Figure 2-3. BQ25306EVM 2-Cell Efficiency.................................................................................................................................
5
Figure 4-1. Top Overlay...............................................................................................................................................................
6
Figure 4-2. Top Solder.................................................................................................................................................................
6
Figure 4-3. Top Layer...................................................................................................................................................................
7
Figure 4-4. Bottom Layer.............................................................................................................................................................
7
Figure 4-5. Bottom Solder............................................................................................................................................................
7
Figure 4-6. Bottom Overlay..........................................................................................................................................................
8
Figure 4-7. BQ25306 Schematic.................................................................................................................................................
9
List of Tables
Table 1-1. Device Data Sheets....................................................................................................................................................
2
Table 1-2. EVM I/O Connections.................................................................................................................................................
2
Table 1-3. EVM Jumper and Shunt Installation............................................................................................................................
2
Table 2-1. Precharge Current Measurement...............................................................................................................................
4
Table 2-2. Fast Charge Current Measurement............................................................................................................................
4
Table 4-1. BQ25306 Bill of Materials.........................................................................................................................................
10
Trademarks
All trademarks are the property of their respective owners.
www.ti.com
Table of Contents
SLUUC50A – MARCH 2020 – REVISED DECEMBER 2020
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BQ25306 (BMS005) Evaluation Module
1
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