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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation

which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms
and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.

2.3

If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

3

Regulatory Notices:

3.1

United States

3.1.1

Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.

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Содержание BoosterPack BOOSTXL-RS232

Страница 1: ...BOOSTXL RS232 BoosterPack Hardware User s Guide Literature Number SLLU250 November 2016 ...

Страница 2: ...ption 5 3 1 Top and Bottom View 5 3 2 Board Overview 5 3 3 Block Diagram 6 3 4 DB9 Connector 7 3 5 Header Descriptions 8 3 6 LED Description 10 4 Functional Modes 11 4 1 Auto Powerdown Plus 11 4 2 Forced On 11 4 3 Forced Off 11 4 4 Invalid 12 5 Interfacing with External Hardware 13 6 Additional Information 14 6 1 Design Files 14 6 2 Hardware Change Log 14 6 3 Schematic 14 6 4 PCB Layout 15 ...

Страница 3: ...L RS232 Overview 5 5 BOOSTXL RS232 Block Diagram 6 6 DB9 Pinout 7 7 GPIO Headers 8 8 Header J9 9 9 Supply Select 9 10 RS232 LEDs 10 11 Interfacing With LaunchPad 13 12 BOOSTXL RS232 Schematic Zoom for Higher Resolution 14 13 Top Layer Routing 15 14 Bottom Layer Routing 15 List of Tables 1 RS 232 Female DB9 Connector Pin Summary 7 2 Driver Functions 11 3 Receiver Functions 11 4 INVALID Status 12 5 ...

Страница 4: ... control RTS CTS channels that can be easily assigned to 1 of 10 general purpose input output GPIO pins These channels on the TRS3122E can be configured to be either one set of data channels and one set of control channels for flow control or to be two sets of data channels However this BoosterPack is configured for one set of data channels RX TX and one set of control channels RTS CTS With its un...

Страница 5: ...edback Copyright 2016 Texas Instruments Incorporated BOOSTXL RS232 BoosterPack Hardware 3 Hardware Description 3 1 Top and Bottom View Figure 2 is a top view of the BOOSTXL RS232 and Figure 3 is a bottom view of the BOOSTXL RS232 Figure 2 Top View of BOOSTXL RS232 Figure 3 Bottom View of BOOSTXL RS232 3 2 Board Overview Figure 4 shows an overview of the BOOSTXL RS232 BoosterPack The main features ...

Страница 6: ...k diagram of the BOOSTXL RS232 BoosterPack The 40 pin BoosterPack header allows the BoosterPack to be easily interfaced with LaunchPads A 3 pin header is available to change VCC VL between 3 3 V and 1 8 V This allows the BoosterPack to communicate with LaunchPads either at 3 3 V or 1 8 V logic levels See Section 3 5 4 for more details The two 30 pin GPIO headers allow for the selection of GPIO pin...

Страница 7: ...sterPack to the connected device through the RS232 interface while TX1 is an input from the connected device to the BoosterPack through the RS232 interface The same applies to the RTS1 input and CTS1 output ports The RX2 TX2 CTS2 and RTS2 ports are used to interface with the microcontroller through 0 V to 3 3 V or 1 8 V TTL signals See Table 1 for information on how the DB9 connector is routed on ...

Страница 8: ... the middle column are connected to their coinciding transceiver pins which are labeled at the bottom of each column this is seen in Figure 7 For example looking at header J5 J6 in Figure 7 the right column coincides with RX2 Placing a jumper across the first pins of the middle column and the right column would short GP3 from the LaunchPad to the DIN1 pin on the TRS3122E NOTE See Section 5 for inf...

Страница 9: ...or to drop the typical 3 3 V VCC on most LaunchPads to 1 8 V This allows for communication with LaunchPads that are capable of communicating at 1 8 V logic levels To switch between a 1 8 V and 3 3 V supply use a jumper on J12 to short the center VCC pin to the desired supply voltage see Figure 9 A short between pin 1 and 2 results in 3 3 V VCC and a short between 2 and 3 results in 1 8 V VCC Pin 1...

Страница 10: ...ation is also denoted next to each LED a sign for the green LED and a sign for the red LED Upon powering the BoosterPack the power LED will turn on and the driver and receiver line LEDs may also be on depending on what the board is connected to Since RS232 TX and RX lines sit at a LOW voltage level until data is transmitted or received the red LED for TX1 and RX1 on the board will be on until data...

Страница 11: ...power states of the transceiver When the jumpers short FORCEON to GP19 and FORCEOFF to GP18 the power down states of the transceiver can be controlled through GPIO see Table 2 and Table 3 4 2 Forced On If the FORCEON and FORCEOFF pins are both set HIGH the device will power on with Auto Powerdown Plus disabled Both the drivers and receivers will be active regardless of inactivity as shown in Table...

Страница 12: ...ble connected to the port A HIGH voltage level on the pin means there is a connection and a LOW voltage level on the pin means there is not a connection see Table 4 1 H high level L low level X irrelevant Z high impedance off Open input disconnected or connected driver off Table 4 INVALID Status 1 Inputs Output RIN1 RIN2 FORCEON FORCEOFF Time Elapsed Since Last RIN or DIN Transition INVALID Any L ...

Страница 13: ...nnected directly to LaunchPad pins J9 is highlighted because the right column is routed directly to header pins that are connected to LaunchPad pins The highlighted headers are color matched to the description boxes on the exterior of the image of the board If the description boxes are labeled it means that they are specifically routed on the BoosterPack For example the first red box on the left i...

Страница 14: ...og_In I2S_WS 27 Analog_In I2S_ SCLK 28 Analog_Out I2S_ SDout 29 Analog_Out I2S_ SDin 30 J1 J3 4 1 2 3 J11 TX1 CTS1 RX1 RTS1 0 R5 CTS1 TX1 RTS1 RX1 GP14 GP14 GP14 3v3 Green 1 2 D1 Green 1 2 D2 Green 1 2 D4 Red 2 1 D7 Red 2 1 D9 5 23k R7 5 23k R8 5 23k R10 GND RX1 CTS1 GND GND TX1 RTS1 GND GND 1 96k R6 Red 2 1 D5 Red 2 1 D3 Green 1 2 D6 Green 1 2 D8 5 23k R9 3v3 1v8 VCC 1 2 3 J12 TSW 103 07 G S VIN ...

Страница 15: ...eedback Copyright 2016 Texas Instruments Incorporated BOOSTXL RS232 BoosterPack Hardware 6 4 PCB Layout Figure 13 shows the top layer routing of the BOOSTXL RS232 Figure 14 shows the bottom layer routing of the BOOSTXL RS232 Figure 13 Top Layer Routing Figure 14 Bottom Layer Routing ...

Страница 16: ... are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repair such EVM or provide replacements Repaired EVMs shall be warranted for the remainder of the original warranty period Replaced EVMs shall be warranted for a new full ninety 90 day wa...

Страница 17: ... by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes détachables Conformément à la rég...

Страница 18: ...connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the inputs and outputs kept within the specified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors cur...

Страница 19: ...F REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED 8 2 Specific Limitations IN NO EVENT SHALL T...

Страница 20: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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