PAD
PAD
PAD
0
200
400
600
800
1000
0
10
20
30
40
50
60
70
80
R
AD
IAT
E
D
EMI
SSI
O
N
S
(d
B
V
/m
)
FREQUENCY (MHz)
Emissions
CISPR 22 Class B Limit
CISPR 22 Class A Limit
LMZ10500
SNVS723C – OCTOBER 2011 – REVISED MARCH 2013
www.ti.com
Radiated EMI (CISPR22)
V
IN
= 5.0V, V
OUT
= 1.8V, I
OUT
= 650mA
Connection Diagram
Figure 1. Package Number NQB0008A
Pin Descriptions
Pin #
Name
Description
1
EN
Enable Input. Set this digital input higher than 1.2V for normal operation. For shutdown, set low. Pin is
internally pulled up to VIN and can be left floating for always-on operation.
2
VCON
Output voltage control pin. Connect to analog voltage from resisitve divider or DAC/controller to set the VOUT
voltage. V
OUT
= 2.5 x V
CON
. Connect a small (470pF) capacitor from this pin to SGND to provide noise
filtering.
3
FB
Feedback of the error amplifier. Connect directly to output capacitor to sense V
OUT
.
4
SGND
Ground for analog and control circuitry. Connect to PGND at a single point.
5
VOUT
Output Voltage. Connected to one terminal of the integrated inductor. Connect output filter capacitor between
VOUT and PGND.
6
PGND
Power ground for the power MOSFETs and gate-drive circuitry.
7
VIN
Voltage supply input. Connect ceramic capacitor between VIN and PGND as close as possible to these two
pins. Typical capacitor values are between 4.7µF and 22µF.
8
VREF
2.35V voltage reference output. Typically connected to VCON pin through a resistive divider to set the output
voltage.
PAD
The 3 pads underneath the module are not internally connected to any node. These pads should be
connected to the ground plane for improved thermal performance.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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