ZE51/61-2.4 RF module User Guide
1VV0300868
Rev.4 – 23/06/201
1
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 4 of 54
CONTENTS
CHAPTER I. INTRODUCTION ................................................................................................................... 6
I.1.
A
IM OF THE
D
OCUMENT
.................................................................................................................................................................................... 6
I.2.
C
ONTACT
I
NFORMATION
,
S
UPPORT
.................................................................................................................................................................. 6
I.3.
R
EFERENCE DOCUMENTS
................................................................................................................................................................................. 7
I.4.
D
OCUMENT CHANGE LOG
................................................................................................................................................................................. 7
I.5.
G
LOSSARY
...................................................................................................................................................................................................... 8
CHAPTER II. REQUIREMENTS ................................................................................................................ 9
II.1.
R
EGULATIONS REQUIREMENTS
........................................................................................................................................................................ 9
II.2.
F
UNCTIONAL
R
EQUIREMENTS
........................................................................................................................................................................ 12
II.3.
S
OFTWARE
.................................................................................................................................................................................................. 12
II.4.
T
EMPERATURE
R
EQUIREMENTS
.................................................................................................................................................................... 13
CHAPTER III. GENERAL CHARACTERISTICS ...................................................................................... 14
III.1.
M
ECHANICAL
C
HARACTERISTICS
................................................................................................................................................................. 14
III.2.
M
ECHANICAL DIMENSIONS
........................................................................................................................................................................... 15
III.3.
DC
C
HARACTERISTICS
................................................................................................................................................................................ 16
III.4.
F
UNCTIONAL CHARACTERISTICS
.................................................................................................................................................................. 17
III.5.
D
IGITAL
C
HARACTERISTICS
......................................................................................................................................................................... 20
III.6.
A
BSOLUTE
M
AXIMUM
R
ATINGS
.................................................................................................................................................................... 21
III.7.
O
RDERING INFORMATION
............................................................................................................................................................................ 22
CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................ 23
IV.1.
P
IN
-
OUT OF THE
SMD
M
ODULE
.................................................................................................................................................................... 23
IV.2.
DIP
M
ODULE MECHANICAL DIMENSIONS AND PIN
-
OUT
................................................................................................................................... 25
IV.3.
P
IN
-
OUT CORRESPONDENCE TABLE
.............................................................................................................................................................. 26
IV.4.
D
ESCRIPTION OF THE
S
IGNALS
..................................................................................................................................................................... 27
CHAPTER V. PROCESS INFORMATION ............................................................................................... 28
V.1.
D
ELIVERY
..................................................................................................................................................................................................... 28
V.2.
S
TORAGE
..................................................................................................................................................................................................... 29
V.3.
S
OLDERING PAD PATTERN
............................................................................................................................................................................. 29
V.4.
S
OLDER PASTE COMPOSITION
(R
O
HS
PROCESS
) ........................................................................................................................................... 31
V.5.
P
LACEMENT
.................................................................................................................................................................................................. 31
V.6.
S
OLDERING PROFILE
(R
O
HS
PROCESS
) ......................................................................................................................................................... 32
CHAPTER VI. BOARD MOUNTING RECOMMENDATION ..................................................................... 34
VI.1.
E
LECTRICAL ENVIRONMENT
.......................................................................................................................................................................... 34
