SL871 Family Product User Guide
1VV0301170 Rev. 9
Page 68 of 89
2021-07-15
Not Subject to NDA
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these devices to
avoid damage from moisture absorption. If localized heating is required to rework or
repair the device, precautionary methods are required to avoid exposure to solder reflow
temperatures that can result in performance degradation.
Note: The module is a Moisture Sensitive Device (MSD) Level 3 as
defined by IPC/JEDEC J-STD-020. This rating is assigned due to
some of the components used within the module.
Please follow the MSD and ESD handling instructions on the labels of the MBB and
exterior carton.
The modules are supplied in a hermetically sealed bag with desiccant and humidity
indicator cards. The module must be placed and reflowed within 168 hours of first
opening the hermetic seal provided the factory ambient conditions are < 30°C and < 60%
R. H., and the humidity indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then
the parts will need to be baked prior to reflow. The parts may be baked at +90°C ± 5°C for
96 hours.
Warning: However, the packaging materials (tape and reel or trays)
can NOT withstand that temperature.
Lower temperature baking is feasible if the humidity level is low and
time is available.
Please see IPC/JEDEC J-STD-
033 “Handling, Packing, Shipping and U
se of
Moisture/Reflow Sensitive Surface Mount Devices
”
for additional information.
Please refer to the MSL tag affixed to the outside of the hermetically sealed bag.
Note: The module is a Moisture Sensitive Device (MSD) Level 3 as
defined by IPC/JEDEC J-STD-020. This rating is assigned due to
some of the components used within the module.
JEDEC standards are available at no charge from the JEDEC website
Содержание SL871
Страница 1: ...SL871 Family Product User Guide 1VV0301170 Rev 9 2021 07 15 Telit Technical Documentation...
Страница 89: ......