ME70-169 RF Module User Guide
1vv0301021 rev.3 – 2014-11-14
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Page 29 of 40
5.4.
Solder past
ME70-169 module is designed for surface mounting using half-moon solder joints (see
diagram below).
For proper module assembly, solder paste must be printed on the target surface of the host
board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of
Cu. The recommended solder paste height is 180
µ
m.
The following diagram shows mounting characteristics for ME integration on host PCB:
5.5.
Placement
The ME70-169 module can be automatically placed on host boards by pick-and-place
machines like any integrated circuit
5.6.
Soldering Profile (RoHS Process)
It must be noted that ME70-169 module should not be allowed to be hanging upside down
during the reflow operation. This means that the module has to be assembled on the side of
the printed circuit board that is soldered last.
The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should
be followed.
