ME70-169 RF Module User Guide
1vv0301021 rev.3 – 2014-11-14
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Page 28 of 40
5.2.
Storage
The optimal storage environment for ME70-169 modules should be dust free, dry and the
temperature should be included between -40°C and +80°C.
In case of a reflow soldering process, ME radio modules must be submitted to a drying bake
at +125°C during 24 hours. The drying bake must be used prior to the reflow soldering
process in order to prevent a popcorn effect. After being submitted to the drying bake, ME
modules must be soldered on host boards within 168 hours.
Also, it must be noted that due to some components, ME70-169 modules are ESD sensitive
device. Therefore, ESD handling precautions should be carefully observed.
5.3.
Soldering pad pattern
The surface finished on the printed circuit board pads should be made of Nickel/Gold surface.
The recommended soldering pad layout on the host board for the ME70-169 is shown in the
diagram below:
All dimensions in mm
Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the
module.
