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Telit GE864 and GC864
Product Description
80273ST10008A Rev. 3 - 10/02/06
Reproduction forbidden without DAI Telecom written authorization – All Right reserved – Right of modification reserved
page 32 of 72
Recommendations for PCB pad dimensions
Ball pitch [mm]
2,5
Solder resist opening diameter A [mm]
1,150
Metal pad diameter B [mm]
1 ± 0.05
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
opening”, unless the microvia carry the same signal of the pad itself.
Holes in pad are allowed only for blind holes and not for through holes.