Telefunken TDV-3000, Руководство по обслуживанию

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1-4-3 DVD_NOTE
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA so
you can install a replacement flat pack-IC more
easily.
(2) The “
I
” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
To Solid
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldering Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
CBA
Flat Pack-IC
Fig. S-1-8