INSTRUCTION MANUAL
PFE500F
Series
TDK-Lambda
<Page>
16.Operating Temperature Range
These products can be used in any mounting direction but be sure to consider enough airflow to avoid heat
accumulation around the module.
Consider surrounding components layout and set the PCB mounting direction such that air can flow through the
heatsink by forced or convection cooling .
This product can operate at actual mounting condition when baseplate temperature is maintained at or below the
following baseplate temperature.
PFE500F-12 : 85 deg C
PFE500F-28,48 : 100 deg C
Verify baseplate temperature at worst case operating condition at the measuring point as shown in Fig. 16-1.
For Thermal Design details, refer to Power Module Application Notes “Thermal Design” section.
Baseplate temperature range is limited according to Fig. 16-2.
To further improve the reliability, it is recommended to use this module with baseplate temperature derating.
17. Operating Humidity
Note that dewdrop might cause power module abnormal operation or damage.
18. Storage Temperature
Note that rapid temperature change causes dewdrop causing harmful effect on soldering condition of the
terminal pins.
19. Storage Humidity
Storage under high temperature and high humidity causes rust on terminal pins that causes deterioration of
soldering conditions. Take enough caution when storing this module.
20. Cooling Method
For details of thermal design, refer to Power Module Application Notes “Thermal Design” section.
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Baseplate
Temperature
Mesuring Point
Fig. 16-1 Baseplate Measuring Point
-40
-20
0
20
40
60
80
100
0
20
40
60
80
100
Baseplate temperture ( ℃)
L
oa
d
(%
)
PFE500F-12
PFE500F-28,48
85
Fig. 16-2 Derating Curve
