20020301
3-3-1
H9200EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE:
Products marked with a
#
have special characteristics important to safety.
Before replacing any of these components, read care-
fully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.
Parts that are not assigned part numbers (---------)
are not available.
2.
Tolerance of Capacitors and Resistors are noted
with the following symbols.
3.
LED Type:
When it is necessary to replace one or more of the
following diodes, all three should be replaced:
D588, D589, D656 on the Main CBA.
When it is necessary to replace one or more of the
following diodes, all four should be replaced: D652,
D653, D654, D655 on the Jack CBA.
DVD MAIN CBA UNIT
MVC CBA
MAIN CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Ref. No.
Description
Part No.
DVD MAIN CBA UNIT
N79F6FUP
Ref. No.
Description
Part No.
MCV CBA
Consists of the following
0VSA12513
MAIN CBA (MCV-A)
FUNCTION CBA (MCV-B)
JACK CBA(MCV-C)
SENSOR CBA
--------------
--------------
--------------
0VSA12518
Ref. No.
Description
Part No.
MAIN CBA(MVC-A)
Consists of the followings
----------
CAPACITORS
C013
ELECTROLYTIC CAP. 10
µ
F/50V M H7
CE1JMAVSL100
C017
FILM CAP.(P) 0.0015
µ
F/100V J or
CMA2AJS00152
FILM CAP.(P) 0.0015
µ
F/50V J
CA1J152MS029
C018
ELECTROLYTIC CAP. 470
µ
F/16V M or
CE1CMASDL471
ELECTROLYTIC CAP. 470
µ
F/16V M
CE1CMASTL471
C019
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C020
ELECTROLYTIC CAP. 1000
µ
F/16V M or
CE1CMZPDL102
ELECTROLYTIC CAP. 1000
µ
F/16V M
CE1CMZPTL102
C021
ELECTROLYTIC CAP. 470
µ
F/10V M or
CE1AMASDL471
ELECTROLYTIC CAP. 470
µ
F/10V M
CE1AMASTL471
C023
ELECTROLYTIC CAP. 100
µ
F/16V M H7
CE1CMAVSL101
C051
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C052
ELECTROLYTIC CAP. 100
µ
F/6.3V H7
CE0KMAVSL101
C053
ELECTROLYTIC CAP. 330
µ
F/6.3V M H7
CE0KMASSL331
C054
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V
CHD1EK30B473
C253
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C255
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C256
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C257
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C301
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C303
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C304
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V
CZM1GK30Y102
C305
CHIP CERAMIC CAP.(MELF) Y K 2200pF/35V
CZM1GK30Y222
C306
CHIP CERAMIC CAP.(MELF) W K 470pF/50V or
CZM1JK30B471
CHIP CERAMIC CAP. CH J 470pF/50V or
CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50V
CHD1JJ3CG471
C307
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C308
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C309
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C310
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C311
CHIP CERAMIC CAP. CH J 390pF/50V or
CHD1JJ3CH391
CHIP CERAMIC CAP. CG J 390pF/50V
CHD1JJ3CG391
C312
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C313
CHIP CERAMIC CAP.(MELF) SL J 18pF/50V or
CZM1JJ3SL180
CHIP CERAMIC CAP. CH J 18pF/50V or
CHD1JJ3CH180
CHIP CERAMIC CAP. CG J 18pF/50V
CHD1JJ3CG180
C314
CHIP CERAMIC CAP.(MELF) SL J 100pF/50V
CZM1JJ3SL101
C315
CHIP CERAMIC CAP.(MELF) SL J 100pF/50V
CZM1JJ3SL101
C317
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C320
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C321
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C322
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C324
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C325
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C326
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C328
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C329
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C330
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C331
CHIP CERAMIC CAP. CH J 330pF/50V or
CHD1JJ3CH331
CHIP CERAMIC CAP. CG J 330pF/50V
CHD1JJ3CG331
C332
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C333
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C335
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C337
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C339
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C340
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C341
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C344
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C345
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C346
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C347
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C348
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
Ref. No.
Description
Part No.
Содержание SSD800
Страница 14: ...Printed in Japan 2002 10 11HO SSD800 H9229UD...
Страница 57: ...1 11 21 1 11 22 Function CBA Top View Function CBA Bottom View BH9200F01012 B...
Страница 97: ...3 1 3 H9200PEX S2 S2 S2 S2 S1 X1 Unit X20 X5 X2 X4 X3 A14 A14 S3 Packing...
Страница 113: ...Printed in Japan 2002 03 22 HO EWD2202 H9200UD...