110
Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual Intel Xeon 3rd Gen Intel Xeon Scalable Processors (Socket P+) with up to 40 cores and a thermal design power (TDP) of
up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors. Certain CPU SKUs
are conditionally supported. Please contact Supermicro Technical Support for additional information about specialized system
optimization.
Chipset
Intel PCH C621A
BIOS
AMI BIOS
ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time Clock)
wakeup, and SMBIOS 3.0 or later
Memory
Up to 4 TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 MHz
in 16 memory slots and up to 4 TB of Intel Optane PMem 200 Series with speeds of up to 3200 MHz
Note:
PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
Storage Drives
Drive Bays:
Four fixed 3.5" SATA drive bays
Connectors:
Two onboard NVMe connectors (optional cables required for NVMe support)
One VROC Key header
PCI Expansion Slots
One PCIe 4.0 x8 slot
Five PCIe 4.0 x16 slots
Two onboard PCIe 4.0 x4 M.2 slots in the 2280 and 22110 form factors
Networking
Two 1GbE LAN ports
Input/Output
COM: one onboard serial COM header
SATA: eight onboard S-SATA 3.0 ports (two are SuperDOM supported)
VGA: one rear VGA port
USB: four rear USB 3.2 Gen 1 ports, one rear USB 3.2 Gen 2 port, two front USB 3.2 Gen 1 ports, one front USB 3.2 Gen 2
Type-C port
Audio: 7.1 HD Audio rear ports, one onboard buzzer header, one front line-out, one front mic-in
Motherboard
X12DAi-N6
Chassis
CSE-735D4-1K26B
Security
Onboard TPM/Port 80 header