Appendix B: System Specifications
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Appendix B
System Specifications
Processors (Per Node)
Dual Intel® Xeon® 81xx/61xx/51xx/41xx/31xx series or 82xx/62xx/52xx/42xx/32xx series processors (support for CPUs with a
TDP of 70-140W)
Note:
Please refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset (Per Node)
Intel Intel® C621 chipset
BIOS (Per Node)
AMI 32Mb SPI Flash ROM with UEFI
Memory (Per Node)
Up to 2TB 3DS ECC RDIMM/LRDIMM to speeds of DDR4-2933MHz in 8 DIMM slots (82xx/62xx series processors)
Up to 1TB 3DS ECC RDIMM/LRDIMM to speeds of DDR4-2666MHz, in 8 DIMM slots (81xx/61xx/51xx/41xx/31xx series
processors)
Note:
See the memory section in Chapter 3 for details and our website for updates to supported memory.
SATA Controller (Per Node)
On-chip (Intel® C621) controller
Drive Bays (Per Node)
3 Hot-swap 3.5" SATA3 drive bays
PCI Expansion Slots (Per Node)
1 PCIe 3.0 x16 low-profile slot
Motherboard (Per Node)
X11DPT-L 6.8 x 16.64 in /172.7 x 422.7 mm (W x D)
Chassis
SC827HQ-R1K68BP3; 2U Rackmount, 17.25 x 3.47 x 28.5 in. / 438 x 88 x 724 mm. (W x H x D)
System Cooling
Four 8-cm counter-rotating PWM fans
Power Supply
1600W 1U Redundant Power Supplies with PMBus
Total Output Power: 800W/1600W
AC Input: 100-140Vac / 10-7A / 50-60Hz
180-240Vac / 11-8A / 50-60Hz
Rated Output Voltages: +12V: Max: 67A / Min: 0A (100-140Vac)
Max: 133A / Min: 0A (180-240Vac)
+5Vsb: Max: 1A / Min: 0A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)