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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Single 3rd Gen Intel® Xeon® Scalable processor in a Single Socket LGA-4189 (Socket P+) supported TDP up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel® C621A
BIOS
256Mb AMI BIOS® SPI Flash BIOS
Memory
Eight slots supports up to 2048GB of ECC RDIMM/LRDIMM/LRDIMM (3DS) with speeds up to 3200MHz.
Storage Drives
Ten 2.5" hot-swap SATA/SAS/NVMe hybrid drive bays
bays
One PCIe 4.0 x16 LP slot(s)
Two PCIe 4.0 x16 FHFL slot(s)
Input/Output
Network: Two 10GbE LAN ports
IPMI: Dedicated LAN port
USB: Two USB 3.2 Gen 1 ports (Rear), two USB 3.2 Gen 1 ports (Front), two USB 2.0 ports (Rear); one USB 3.2 Gen 1 Type
A (Internal)
Video: One VGA port
Serial: One serial port
Motherboard
X12SPW-TF; Length 13", width 8" (330.2 mm x 203.2 mm)
Chassis
CSE-116AC10-R706WBP4; 1U Rackmount, (WxHxD) 17.2 x 1.7 x 23.5 in. (437 x 43 x 597 mm)
System Cooling
Five 4-cm counter-rotating fans, one CPU heatsink, one air shroud to direct air flow
Power Supply
Model: PWS-706P-1R, 750 W redundant modules, 80Plus Platinum level
AC Input Voltages: 100-240 VAC
Rated Input Current: 8.5A to 6A
Rated Input Frequency: 50-60 Hz
Rated Output Power: 700/750W
Rated Output Voltages: +3.3V (25A), +5V (25A), +12V (700W: 58A at 100V-140V, 750W: 62A at 180V-240V), -12V (0.6A),
+5Vsb (3A)