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STM32F042x4 STM32F042x6
Electrical characteristics
89
6.3 Operating
conditions
6.3.1
General operating conditions
6.3.2 Operating
conditions
at power-up / power-down
The parameters given in
are derived from tests performed under the ambient
temperature condition summarized in
Table 21. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
f
HCLK
Internal AHB clock frequency
-
0
48
MHz
f
PCLK
Internal APB clock frequency
-
0
48
V
DD
Standard operating voltage
-
2.0
3.6
V
V
DDIO2
I/O supply voltage
Must not be supplied if V
DD
is not present
1.65
3.6
V
V
DDA
Analog operating voltage
(ADC not used)
Must have a potential equal
to or higher than V
DD
V
DD
3.6
V
Analog operating voltage
(ADC used)
2.4
3.6
V
BAT
Backup operating voltage
-
1.65
3.6
V
V
IN
I/O input voltage
TC and RST I/O
-0.3
V
DDIOx
+0.3
V
TTa I/O
-0.3
V
DDA
+0.3
(1)
FT and FTf I/O
-0.3
5.5
P
D
Power dissipation at T
A
= 85 °C
for suffix 6 or T
A
= 105 °C for
suffix 7
(2)
LQFP48
-
364
mW
UFQFPN48
-
606
WLCSP36
-
313
LQFP32
-
351
UFQFPN32
-
526
UFQFPN28
-
170
TSSOP20
-
263
T
A
Ambient temperature for the
suffix 6 version
Maximum power dissipation
–40
85
°C
Low power dissipation
(3)
–40 105
Ambient temperature for the
suffix 7 version
Maximum power dissipation
–40
105
°C
Low power dissipation
–40 125
T
J
Junction temperature range
Suffix 6 version
–40
105
°C
Suffix 7 version
–40
125
1. For operation with a voltage higher than V
DDIOx
+ 0.3 V, the internal pull-up resistor must be disabled.
2. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
Jmax
. See
Section 7.8: Thermal characteristics
.
3. In low power dissipation state, T
A
can be extended to this range as long as T
J
does not exceed T
Jmax