Operating Instructions KB2 Keyboards
Safety
Page 12 of 68
R. STAHL HMI Systems GmbH / OI_Keyboard_KB2_en_V_01_00_02.docx / 07.03.2022
R. STAHL recommends having a level of knowledge equal to that described in the following
standards:
IEC/EN 60079-14 (Electrical installations design, selection and erection)
IEC/EN 60079-17 (Inspection and maintenance of electrical installations)
IEC/EN 60079-19 (Equipment repair, overhaul and reclamation)
3.4
Special conditions of use
The devices (including their connection cables) may only be installed in areas where there are
absolutely no intensive electrostatic loading processes.
If the devices are to be used in areas with dust-explosion hazard, they need to be installed in a
suitable enclosure to achieve at least IP64 (acc. to EN IEC 60079-0).
If the device is supplied with a current of over 250 mA in an area with dust-explosion hazard, this
must be via an ia current (linear characteristic).
Additional requirements for KB2 / PD2 only
When the devices are used in gas hazardous areas they have to be installed in a suitable
enclosure so that at least IP20 is achieved (acc. to IEC 60529).
The KB2 and PD2 device versions are suitable for installation into the cut-out of an enclosure with
IP64 (acc. to EN IEC 60079-0), or into the cut-out of an enclosure with degree of protection
EX eb / ec or Ex tb / tc or Ex p. In this case, they fulfil the respective enclosure requirements.
Additional information for KB2 with pointing device and KB2-HSG only
The connection cable of the devices contains two separate intrinsically safe circuits.
The device
must be installed in such a way that there is no mechanical impact (tensile force) onto the cable.
The cable must be fixed and effectively protected against damage.
Additional information for installation in HSG enclosure
As a minimum, the installed device must have the same IP degree of protection as the enclosure,
and must also be separately certified for this IP degree of protection.
The enclosure must be connected to ground potential, and this connection must not exceed 1
MΩ
against the ground.
Where appropriate, assembly components or the ground connection of the
installed devices may be used.
