UM2231 Rev 6
19/26
UM2231
Layout recommendation
24
8 Layout
recommendation
To guarantee good RF performance, 0402 components are preferable because they avoid
having too big component pads compared with RF 50 ohms line.
Place parallel components pads on 50 ohms line as in
Figure 13
.
Figure 13. Placing parallel component pads on 50 ohms line
For 50 ohms line bypassing it’s suggested to superimpose the pad of one component on the
pad of the other one as in
Figure 14
.
Figure 14. Reuse pads of one component on the line bypassing
Place ground vias below Teseo-LIV3 all around and in the middle and also around the 3
ground pins.
The following layout presents layout recommendation to ensure the best performances of
Teseo-LIV3. ST heartily recommends having a maximum of ground vias below the module
as illustrated in the
Figure 15
.
