1
Getting started
1.1
Overview
expands
functionality.
The software package enables the IO-Link data transfer of industrial sensors on the STEVAL-IOD004V1 towards
an IO-Link master connected through an IO-Link connection.
The key package features are:
•
Firmware package to build IO-Link device applications based on the
microcontroller
•
Middleware libraries featuring IO-Link device demo-stack for
and
MEMS sensors
•
Ready-to-use binary for IO-Link device sensor data transmission
•
Easy portability across different MCU families, thanks to
•
Free, user-friendly license terms
1.2
Architecture
The application software accesses the STEVAL-IOD004V1 through the following software layers:
•
STM32Cube HAL layer
, which provides a simple, generic, multi-instance set of application programming
interfaces (APIs) to interact with the upper application, library, and stack layers. It has generic and extension
APIs and is directly built around a generic architecture. It allows successive layers like the middleware layer
to implement functions without requiring specific hardware configurations for a given microcontroller unit
(MCU). This structure improves library code reusability and guarantees an easy portability on other devices.
•
Board Support Package
(BSP) layer, which supports all the peripherals on the board except the MCU. This
limited set of APIs provides a programming interface for certain board-specific peripherals like the LED, the
user button, etc. This interface also helps in identifying the specific board version.
Figure 1.
STSW-IOD04K software architecture
Applications &
demonstrations
STSW-IOD04K
Hardware Abstraction
Layer
MEMs Manager
Middleware
Hardware
Abstraction
Hardware
STEVAL-IOD004V1
L6364W
STM32G071EB
IO-Link Stack
IIS2MDC
ISM330DHCX
UM2943
Getting started
UM2943
-
Rev 1
page 2/13
