2
XR-CA350X
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1.
GENERAL
Location of Controls .......................................................
3
Setting the Clock .............................................................
3
2.
DISASSEMBLY
2-1. Disassembly Flow ...........................................................
7
2-2. Sub Panel .........................................................................
7
2-3. Mechanism Deck (MG-36SZ13-32) ...............................
8
2-4. MAIN Board ...................................................................
8
2-5. Heat Sink .........................................................................
9
2-6. Bracket (MD) ..................................................................
9
2-7. DC Motor (Capstan/Reel) (M901) ................................. 10
2-8. Main Belt, Sub Belt (C) .................................................. 10
2-9. Head (Playback) (HP901) ............................................... 11
3.
MECHANICAL ADJUSTMENTS
....................... 12
4.
ELECTRICAL ADJUSTMENTS
......................... 12
Tape Deck Section .......................................................... 12
Tuner Section .................................................................. 13
5.
DIAGRAMS
5-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 14
5-2. Printed Wiring Board – MAIN Board – ........................ 15
5-3. Schematic Diagram – MAIN Board (1/2) – .................. 16
5-4. Schematic Diagram – MAIN Board (2/2) – .................. 17
5-5. Printed Wiring Board – CONTROL Board – ................ 18
5-6. Schematic Diagram – CONTROL Board – ................... 19
5-7. IC Pin Function Description ........................................... 21
6.
EXPLODED VIEWS
6-1. General Section ............................................................... 23
6-2. Front Panel Section ......................................................... 24
6-3. MAIN Board Section ...................................................... 25
6-4. Mechanism Deck Section (MG-36SZ13-32) ................. 26
7.
ELECTRICAL PARTS LIST
............................... 27