— 2 —
TABLE OF CONTENTS
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron aroud 270˚ C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SECTION 1
GENERAL
1.
GENERAL
······································································ 2
2.
DISASSEMBLY
2-1.
Cabinet (REAR) ································································· 3
2-2.
Main Board ········································································· 4
2-3.
Lid, Cassette ······································································· 4
2-4.
Mechanism Deck ································································ 5
2-5.
“BELT” “MOTOR” “PINCH LEVER” “HEAD,
MAGNETIC” ····································································· 5
3.
MECHANICAL ADJUSTMENT
······························ 6
4.
ELECTRICAL ADJUSTMENT
································ 6
5.
DIAGRAMS
5-1.
Block Diagram ··································································· 7
5-2.
Printed Wiring Board ·························································· 9
5-3.
Schematic Diagram ·························································· 11
5-4.
IC Block Diagram ···························································· 13
6.
EXPLODED VIEWS
6-1.
Cabinet Section ································································· 14
6-2.
Main Board Section ·························································· 15
6-3.
Mechanism Section-1 ······················································· 16
6-4.
Mechanism Section-2 ······················································· 17
7.
ELECTRICAL PARTS LIST
··································· 18
This section is extracted
from instruction manual.
