Sony TDM-IP1 - Digital Media Port Dock, Руководство по обслуживанию

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13
TDM-iP1
SECTION 5
ELECTRICAL PARTS LIST
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
NOTE:
•
Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
•
-XX and -X mean standardized parts, so they
may have some difference from the original
one.
•
RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
•
Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•
SEMICONDUCTORS
In each case, u:
µ
, for example:
uA... :
µ
A... uPA... :
µ
PA...
uPB... :
µ
PB... uPC... :
µ
PC...
uPD... :
µ
PD...
•
CAPACITORS
uF:
µ
F
•
COILS
uH:
µ
H
•
Abbreviation
CND: Canadian model
A-1253-213-A MAIN BOARD, COMPLETE (US, CND)
A-1274-047-A MAIN BOARD, COMPLETE (AEP)
*********************
< CAPACITOR >
C001 1-110-530-11 ELECT CHIP 1000uF 20% 6.3V
C011 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C013 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C015 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
C016 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C017 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
(AEP)
C018 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
(AEP)
C019 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C020 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C022 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C023 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C024 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C025 1-164-862-11 CERAMIC CHIP 33PF 5% 50V
C026 1-164-860-11 CERAMIC CHIP 27PF 5% 50V
C027 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C029 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C030 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C031 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C032 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C036 1-165-887-91 CERAMIC CHIP 0.22uF 10% 6.3V
C037 1-165-887-91 CERAMIC CHIP 0.22uF 10% 6.3V
C038 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C043 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C044 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C045 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C050 1-128-392-11 ELECT CHIP 470uF 20% 6.3V
C053 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C059 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C060 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C061 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C062 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C063 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C064 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C065 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C066 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C067 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C068 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C069 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C070 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C071 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C074 1-128-004-11 ELECT CHIP 10uF 20% 16V
C075 1-128-004-11 ELECT CHIP 10uF 20% 16V
C076 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C077 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C078 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C079 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C081 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C082 1-164-862-11 CERAMIC CHIP 33PF 5% 50V
< CONNECTOR >
CN001 1-821-015-11 PIN, CONNECTOR (PRINT PWB) 14P
CN002 1-820-701-11 PIN, CONNECTOR 30P
CN007 1-779-328-51 CONNECTOR, FFC/FPC 8P
< DIODE >
D001 6-501-193-01 DIODE 1SS355WTE-17
D011 6-501-021-01 DIODE SML-521MDWT86 (OPR MODE)
< FERRITE BEAD >
FB001 1-414-760-21 INDUCTOR, FERRITE BEAD
< IC >
IC001 6-710-630-01 IC MB90050PF-G-121-MSE1
IC003 6-807-513-01 IC M30624MGP-B50GPU0
IC006 6-709-888-01 IC TC7WHU04FK(T5RSOYF)
IC007 6-711-006-01 IC TC74VHC00FK(EL,K)
IC009 6-702-302-01 IC TK11133CSCL-G
IC010 8-759-295-90 IC NJM2244M-TE2
IC015 6-710-821-01 IC NJM2505AF(TE2)
IC016 8-759-695-10 IC M93C46-WDW6T
IC017 6-707-593-01 IC PST3641UL
< JACK >
J009 1-779-494-21 JACK (VIDEO OUT)
< COIL >
L002 1-469-553-21 INDUCTOR 4.7uH
L003 1-469-557-21 INDUCTOR 22uH
L004 1-469-555-21 INDUCTOR 10uH
L005 1-469-553-21 INDUCTOR 4.7uH
When indicating parts by reference
number, please include the board .
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