2
STR-KS500
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
DISASSEMBLY
2-1.
Disassembly Flow ...........................................................
5
2-2.
Case (SL500) ...................................................................
5
2-3.
Front Panel Assy ..............................................................
6
2-4.
MAIN Board ....................................................................
6
3.
TEST MODE
..............................................................
7
4.
DIAGRAMS
4-1.
Block Diagram – AUDIO DSP Section – ........................
8
4-2.
Block Diagram – TUNER/AUDIO AMP Section – ........
9
4-3.
Block Diagram
– DISPLAY/POWER SUPPLY Section – ....................... 10
4-4.
Printed Wiring Board
– DIGITAL Board (Component Side) – .......................... 12
4-5.
Printed Wiring Board
– DIGITAL Board (Conductor Side) – ............................ 13
4-6.
Schematic Diagram – DIGITAL Board (1/3) – ............... 14
4-7.
Schematic Diagram – DIGITAL Board (2/3) – ............... 15
4-8.
Schematic Diagram – DIGITAL Board (3/3) – ............... 16
4-9.
Schematic Diagram – MAIN Section (1/3) – .................. 17
4-10. Schematic Diagram – MAIN Section (2/3) – .................. 18
4-11. Schematic Diagram – MAIN Section (3/3) – .................. 19
4-12. Printed Wiring Board – MAIN Board – .......................... 20
4-13. Printed Wiring Boards
– SPEAKER/STANDBY Boards – ................................. 21
4-14. Printed Wiring Boards – PANEL Section – ..................... 22
4-15. Schematic Diagram – PANEL Section – ......................... 23
5.
EXPLODED VIEWS
5-1.
Front Panel Section ......................................................... 32
5-2.
Chassis Section ................................................................ 33
6.
ELECTRICAL PARTS LIST
................................ 34
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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