Sony STR-DN850, Руководство по обслуживанию, Страница: 58 / 106

STR-DN850
STR-DN850
58 58
5-36. PRINTED WIRING BOARD – HEADPHONE Board –
• See page 31 for Circuit Boards Location. • : Uses unleaded solder.
5-37. SCHEMATIC DIAGRAM – HEADPHONE Board –
1
A
B
C
D
E
F
2 3 4 5 6 7 8
LP106
J101
1 5 3
CN107
C160
C162
C161
CL185
CL186
CL187
CL188
MAIN
BOARD
CN391
(Page 43)
>009P
HEADPHONE BOARD
PHONES
1-889-541-
12
(12)
1
A
B
2 3 4 5
HEADPHONE BOARD
CL185
CL186
CL187
CL188
CN107
5P
C160
0.001u
C162
0.001u
C161
0.001u
J101
PHONES
1 HP_DETECT
3 HP_R
4 HP_GND
5 HP_L
1
2
3
4
5
6
7
>036S
MAIN BOARD
(2/4)
CN391
(Page 46)
• Waveforms
– DIGITAL Board –
3.0 Vp-p
4.0 MHz
1 IC2100
rk
(PE2/X0)
500 mV/DIV, 100 ns/DIV
1.2 Vp-p
24.5 MHz
qs IC2107
ea
(XOUT)
200 mV/DIV, 10 ns/DIV
1.2 Vp-p
24.5 MHz
qd IC2107
es
(XIN)
200 mV/DIV, 10 ns/DIV
744 mVp-p
25 MHz
2 IC2502
wg
(XTAL2)
200 mV/DIV, 10 ns/DIV
8.8 Vp-p
20 ms
6 IC2107
3
(MCKIN)
2 V/DIV, 5 ms/DIV
8.8 Vp-p
20 ms
7 IC2107
4
(BCKIN)
2 V/DIV, 5 ms/DIV
9.12 Vp-p
20 ms
8 IC2107
5
(LRCKIN)
2 V/DIV, 5 ms/DIV
3.4 Vp-p
20 ms
qa IC2107
qh
(DATAOUT)
2 V/DIV, 5 ms/DIV
316 mVp-p
27.0 MHz
qf
IC3506
<zzc
(XTALOUT)
50 mV/DIV, 10 ns/DIV
180 mVp-p
27.0 MHz
qg IC3506
<zzv
(XTALIN)
50 mV/DIV, 100 ns/DIV
4 IC2502
ok
(BCLK_OUT)
100 mV/DIV, 25 ns/DIV
68.3 ns
492 mVp-p
q; IC2107
qg
(LRCKOUT)
500 mV/DIV, 5
P
s/DIV
20 ms
3.36 Vp-p
5 IC3000
ij
(X1)
100 mV/DIV, 100 ns/DIV
4.0 MHz
352 mVp-p
3 IC2502
ug
(BCLK_IN)
100 mV/DIV, 100 ns/DIV
340 mVp-p
3.0 MHz
9
IC2107
qf
(BCKOUT)
500 mV/DIV, 100 ns/DIV
3.4 Vp-p
3.0 MHz