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Specifications ........................................................................... 1

1. GENERAL

Setting up the phone .......................................................... 3
Making and Receiving calls ............................................... 4
Speed dialing ...................................................................... 4
Paging ................................................................................ 4
Making and Receiving calls using the
head set (SPP-N1003) ........................................................ 5
Mounting the base unit on a wall ....................................... 5
Resetting the digital security code ..................................... 5

2. DISASSEMBLY

2-1. Cabinet (Upper) .......................................................... 6
2-2. Base Main Board ........................................................ 6
2-3. Cabinet (Rear) ............................................................. 7
2-4. Jack Board (SPP-N1003 Only) ................................... 7
2-5. Hand Main Board ....................................................... 8

3. TEST MODE

................................................................... 9

4. ELECTRICAL ADJUSTMENTS

Base Unit Section .............................................................. 11
Handset section ................................................................ 13

5. DIAGRAMS

5-1. Explanation of IC Terminals ..................................... 15
5-2. Block Diagrams (Base Unit Section) ........................ 17
5-3. Block Diagrams (Handset Section) .......................... 19
5-4. Printed Wiring Boards (Base Unit Section) .............. 21
5-5. Schematic Diagram (Base Unit Section) .................. 23
5-6. Printed Wiring Boards (Handset Section) ................ 25
5-7. Schematic Diagram (Handset Section) ..................... 27
5-8. Printed Wiring Boards (Jack Section)

(SPP-N1003 Only) ................................................... 29

5-7. Schematic Diagram (Jack Section)

(SPP-N1003 Only) ................................................... 30

6. EXPLODED VIEWS

6-1. Base Unit Section ..................................................... 31
6-2. Handset Section ........................................................ 32
6-3. Head set Section (SPP-N1003 Only) ........................ 33

7. ELECTRICAL PARTS LIST

.................................... 34

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK

OR DOTTED LINE WITH

MARK

ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270

C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

TABLE OF CONTENTS

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE

SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

NOTE ON BASE MAIN BOARD AND HAND MAIN
BOARD REPAIR

As for base main board and hand main board, there are two type
of “A type” and “B type” by difference of diodes (D401 and
D402) used.

Difference parts list

Base main board

A type

B type

D401, D402

BB145B-115 or

1SV314 (TPH3)

HVU-355BTRF

C451

10PF