– 2 –
Specifications ........................................................................... 1
1. GENERAL
Location and Function of Controls .................................... 3
Step 1 : Checking the Package Contents ............................ 5
Step 2 : Setting up the Base Unit ....................................... 5
Step 3 : Preparing the Battery Pack ................................... 6
Making Calls ...................................................................... 7
Receiving Calls .................................................................. 7
Speed Dialing ..................................................................... 8
Paging ................................................................................ 8
Reseting the dDigital Security Code .................................. 9
Mounting the Base Unit on a Wall ..................................... 9
2. DISASSEMBLY
2-1. Cover (Battery) Removal .......................................... 10
2-2. Rear (Cabinet) Removal ........................................... 10
2-3. Hand Main Board Removal ...................................... 10
3. TEST MODE
.......................................................... 11
4 . BASE UNIT TEST MODE
STATUS FLOW CHART
...................................... 18
5. ELECTRICAL ADJUSTMENTS
5-1. Base Unit Section ..................................................... 19
5-2. Handset section ......................................................... 20
6. DIAGRAMS
6-1. Explanation of IC Terminals ..................................... 22
6-2. Block Diagram (Base Unit Section) ......................... 24
6-3. Block Diagram (Handset Section) ............................ 27
6-4. Printed Wiring Boards (Base Unit Section) .............. 30
6-5. Schematic Diagram (Base Unit Section) .................. 33
6-6. Schematic Diagram (Handset Section) ..................... 37
6-7. Printed Wiring Boards (Handset Section) ................ 41
7. EXPLODED VIEWS
7-1. Base Unit Section ..................................................... 47
7-2. Handset Section ........................................................ 48
8. ELECTRICAL PARTS LIST
................................ 49
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE WITH
MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Содержание SPP-M100
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