
22
22
SPP-114
5-6. PRINTED WIRING BOARD — HANDSET SECTION —
Note:
•
X
: parts extracted from the component side.
•
: Carbon pattern.
•
¢
: internal component.
•
b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
IC501
B-10
Q51
A-1
Q52
A-2
Q54
B-1
Q201
D-9
Q301
A-13
Q501
C-8
Q502
C-8
D51
A-3
D202
B-14
D301
A-14
D501
D-6
D502
A-10
D504
A-11
IC101
B-5
IC201
D-14
• Semiconductor Location
Ref. No.
Location
Ref. No.
Location
Содержание SPP-114
Страница 3: ...3 SECTION 1 GENERAL This section is extracted from instruction manual ...
Страница 4: ...4 ...
Страница 5: ...5 ...
Страница 21: ...21 21 SPP 114 5 5 SCHEMATIC DIAGRAM BASE UNIT SECTION ...
Страница 23: ...23 23 SPP 114 5 7 SCHEMATIC DIAGRAM HANDSET SECTION Refer to page 24 for Note ...