3-3
PCV-R532DS/R536DS/R538DS/R539DS
3-2.
P2B-AE MOTHERBOARD (for PCV-R536DS/R538DS/R539DS)
3-2-1
Over
vie
w
This
document
descr
ibes the
specification
for
the P2B-AE
motherboard
for PCV
-R536DS/R538DS/R539DS
.
•
MicroA
TX
v
ersion1.0
compatib
le
•
Slot
1,
Single
P
entiumII/Deschutes
,
Katmai Copper
mine
processor
,
all speeds
,
v
oltages
,
b
us frequencies
suppor
t.
Can
suppor
t
both
100MHz/66MHz
FSB
.
•
VRM 8.4 suppor
t
•
Hardw
are
monitor
ing
CPU T
emp/sensor
(visibility of this f
eature
is remo
v
ed
from BIOS)
•
T
w
o
168-pin DIMM soc
k
ets
(SDRAM, maxim
um
512Mb
ytes
NonECC)
•
Intel
440BX
Chipset
•
Winbond
W83977EF-A
W
Super I/O Controller
•
One A
G
P
,
Three PCI slots and
NO
ISA slot
•
Ultr
a
DMA/33
enab
le
•
on
board
PCI/A
C97
A
udio
(A
ureal
A
U8830,
AKM
AK4542VQ)
•
Soc
k
etted
Flash
BIOS
•
On board IEEE1394 OHCI LINK and PHY (TI TSB41L
V02/TSB12L
V22)
•
Header
for
F
ront
accessib
le
IEEE1394
connector
.
•
Header
for
F
ront-accessib
le
USB connector
.
•
No
Q-salt
capacitors
•
PC99
Compliant
3-2-2
Form
factor
Meet Intel MicroA
TX
v
ersion
1.0 specification
•
maxim
um
9.6inches
x
9.6
inches(244mmx244mm)
•
height
restr
ictions
of
MicroA
TX
v
ersion
1.0
3-2-3
Connector
s and
Header
s
•
Slot 1 connector ( .159" (4.04mm) mounting holes)
•
Heat Sink Suppor
t
(HSS) mounting holes
.
•
2 168pin DIMM soc
k
et
( gold plated)
•
SFX
A
TX
po
w
er supply
po
w
er connector
,
P
o
w
er
Supply
F
an
connector
•
1 FDD / 2 IDE Connectors
•
4-pin CD-R
OM
audio input (stereo) connector
•
4-pin A
UX
audio input (stereo) connector
•
4-pin
MODEM input/output header
(not
installed)
•
1
P
a
rallel(25pin)
connector
•
1
Game
P
o
rt
(15pin)
connector
•
1 Ser
ial
(9pin) connector f
or
COM1.
One header f
or
COM2 on MB (not installed)
•
2
PS/2
connector
(K
e
yboard,
Mouse)
•
One
IEEE1394(6pin)
standard
interf
ace
connector
,
T
w
o
headers
for
front
connector
(only
one is used)
•
1 USB por
t
connector on rear I/O
,
1 header f
or
front connector
•
1 Optical Digital A
udio(SPDIF)
output connector (not installed)
•
Line
In/Mic
In/Headphone
Out
mini-jac
k
•
P
o
w
er/Sleep/HDD/Reset
header ( included in the P
anel
header )
•
W
a
k
e
on
LAN
header
(Including
5VSB)
(not
installed)
•
1 Cooling F
an
connector(f
or
CPU
,
not used)
•
Exter
nal
speak
er
header ( included in the P
anel
header )
•
Clear
pass
w
ord
header
(f
or
BIOS)
included
in
DIP-SW
•
Buzz
er
3-2-5
P
o
wer Mana
g
ement
•
APM
1.2
•
On-Now
•
ACPI
1.0
,
supporting
following S0,
S1,
S5
power
states
Global State
/Sleep State
CPU state
Note
Support
G0/S0
C
0
W
orking
Y
E
S
G1/S1
C
1
Sleep ( no system context is lost)
Y
E
S
G1/S2
C
2
Sleep(CPU,cache
context is lost) *1
N
O
G1/S3
?
Suspend to RAM
(CPU,cache,chipset
context is lost) *1
NO
G1/S4
?
Suspend to DISK
N
O
G2/S5
?
Soft Of
f
( Power Of
f,
no context is saved)
Y
E
S
G3/--
-
No Power(AC Fail)
Y
E
S
*1 Operating System is responsible for maintaining the context.
S2 function support is mount option (default is no mount).
3-2-6
Flopp
y
Drive
Suppor
t
•
720K/1.2/1.44/2.88
MB diskette drive support
•
Support 3 mode FDD for Japanese market
3-2-7
CD-R
OM/D
VD-R
OM
Drive
Suppor
t
•
Bootable
CD
support
3-2-8
IDE
Drive
Suppor
t
•
2
channel
(4
devices) support
through
PIIX4e
•
Ultra
DMA/33
support
256 MB is not supported of
ficially
.
3-2-9
Main
Memor
y
•
2
x168pin
DIMM
sockets
•
support PC100 unbuf
fered
64-bit SDRAM 3.3V DIMMS( single or double sided) below
DIMM size
Configuration
8M
B
1
Mbit x 64
1
6
M
B
2
Mbit x 64
3
2
M
B
4
Mbit x 64
6
4
M
B
8
Mbit x 64
128MB
16Mbit x 64
256MB
32Mbit x 64
3-2-4
BIOS
•
DMI
V2.0
•
Flash
ROM,
Upgradable
by
user
•
Sony customization ( i.e Sony jingle/logo during boot up)
*
