Sony Hi-MD WALKMAN MZ-DH710, Руководство по обслуживанию

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MZ-DH710
23 23
MZ-DH710
•
Waveforms
2
IC501
ra
(FE)
(MD play mode)
100 mV/DIV, 500 ns/DIV
Approx.
280 mVp-p
1
IC501
8
(RFO)
(MD play mode)
500 mV/DIV, 500 ns/DIV
1.0 Vp-p
3
IC501
rs
(TE)
(MD play mode)
200 mV/DIV, 500 ns/DIV
Approx.
100 mVp-p
4
IC801
<zb,
(FS4)
1 V/DIV, 50 ns/DIV
88 ns
2.6 Vp-p
5.7
µ
s
2.3 Vp-p
5
IC801
<zmv
(FS256_OUT)
1 V/DIV, 2
µ
s/DIV
44 ns
2.6 Vp-p
6
IC801
<czz
(OSCO)
1 V/DIV, 20 ns/DIV
•
Note For Printed Wiring Boards and Schematic Diagrams
•
MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
•
Lead Layouts
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f : internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
•
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Circled numbers refer to waveforms.
•
Signal path.
E
: PLAYBACK
j : REC
d
: USB input from PC
G
: USB output to PC
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f : internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Lead layout of conventional IC
CSP (chip size package)
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
*
Replacement of IC501, IC601 and IC801 used in this
set requires a special tool.
* Replacement of IC501, IC601 and IC801 used in this set
requires a special tool.
surface
Note:
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.