Sony HCD-SPZ90DAB, Руководство по обслуживанию

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HCD-SPZ90DAB
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 3
2. GENERAL
................................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Case ................................................................................. 6
3-3. Front Panel Assy .............................................................. 7
3-4. Tape Mechanical Deck (CFP42601) ............................... 7
3-5. MAIN Board .................................................................... 8
3-6. Base Unit (BU-K6BD83S-WOD Assy)/
Belt (DLM3A) ................................................................. 8
3-7. AMP/SP/POWER Boards ............................................... 9
3-8. DAB Module Assy .......................................................... 9
4. TEST MODE
.............................................................. 10
5. MECHANICAL ADJUSTMENTS
....................... 12
6. ELECTRICAL ADJUSTMENTS
......................... 12
7. DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ......................... 15
7-2. Block Diagram – MAIN Section – .................................. 16
7-3. Block Diagram – AMP Section – .................................... 17
7-4. Block Diagram
– PANEL/POWER SUPPLY Section – ........................... 18
7-5. Printed Wiring Board – CD Board – ............................... 20
7-6. Schematic Diagram – CD Board – .................................. 21
7-7. Printed Wiring Board – TC Board – ................................ 22
7-8. Schematic Diagram – TC Board – .................................. 23
7-9. Printed Wiring Boards – DAB Section – ......................... 24
7-10. Schematic Diagram – DAB Section – ............................. 25
7-11. Printed Wiring Board – MAIN Board – .......................... 26
7-12. Schematic Diagram – MAIN Board (1/3) – .................... 27
7-13. Schematic Diagram – MAIN Board (2/3) – .................... 28
7-14. Schematic Diagram – MAIN Board (3/3) – .................... 29
7-15. Printed Wiring Board – AMP Board – ............................ 30
7-16. Schematic Diagram – AMP Board – ............................... 31
7-17. Printed Wiring Board – PANEL Section (1/2) – ............. 32
7-18. Printed Wiring Boards – PANEL Section (2/2) – ............ 33
7-19. Schematic Diagram – PANEL Section (1/2) – ................ 34
7-20. Schematic Diagram – PANEL Section (2/2) – ................ 35
7-21. Printed Wiring Board – POWER Board – ....................... 36
7-22. Schematic Diagram – POWER Board – .......................... 37
8. EXPLODED VIEWS
8-1. Overall Section ................................................................ 52
8-2. Front Panel Section ......................................................... 53
8-3. FL Section ....................................................................... 54
8-4. CD Section ...................................................................... 55
8-5. Power Section .................................................................. 56
9. ELECTRICAL PARTS LIST
................................ 57
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
DAB frequency table (Band-III)
Frequency Label Frequency Label
174.928 MHz 5A 209.936 MHz 10A
176.640 MHz 5B 211.648 MHz 10B
178.352 MHz 5C 213.360 MHz 10C
180.064 MHz 5D 215.072 MHz 10D
181.936 MHz 6A 216.928 MHz 11A
183.648 MHz 6B 218.640 MHz 11B
185.360 MHz 6C 220.352 MHz 11C
187.072 MHz 6D 222.064 MHz 11D
188.928 MHz 7A 223.936 MHz 12A
190.640 MHz 7B 225.648 MHz 12B
192.352 MHz 7C 227.360 MHz 12C
194.064 MHz 7D 229.072 MHz 12D
195.936 MHz 8A 230.784 MHz 13A
197.648 MHz 8B 232.496 MHz 13B
199.360 MHz 8C 234.208 MHz 13C
201.072 MHz 8D 235.776 MHz 13D
202.928 MHz 9A 237.488 MHz 13E
204.640 MHz 9B 239.200 MHz 13F
206.352 MHz 9C
208.064 MHz 9D
* Frequencies are displayed to two decimal places on this system.
General
Power requirements: 220 – 240 V AC, 50/60 Hz
Power consumption: 40 watts
Dimensions (w/h/d) (excl. speakers): Approx. 180
×
280
×
331 mm
Mass (excl. speakers): Approx. 4.3 kg
Design and specifications are subject to change without notice.
This appliance is classified
as a CLASS 1 LASER
product. This marking
is located on the rear
exterior.