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28
HCD-GTR6/GTR6B/GTR7/GTR8/GTR8B
HCD-GTR6/GTR6B/GTR7/GTR8/GTR8B
5-7. CIRCUIT BOARDS LOCATION
Motor Drive board
included in METER DISPLAY ASSY
MAIN board
HEAD PHONE board
MIC CD board
CD SW board
STR board
Display board
SW board
included in METER DISPLAY ASSY
LED board
included in METER DISPLAY ASSY
USB CD board
MIC RV board
TUNER PACK
FRONT board
SUBWOOFER board
DMB19 board
DRIVER board
SENSOR board
MOTOR (TB) board
MOTOR (LD) board
SUBTRANS board
TRANS board
HUB board
SW board
• Note For Printed Wiring Boards And Schematic Diagrams
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
•
Indication of transistor.
•
A
: B+ Line.
•
B
: B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• BD93 and Driver sections.
no mark : CD PLAY
• Except BD93 and Driver sections.
no mark : FM
(
)
:
CD
PLAY
<
>
:
TAPE
PLAY
[
]
:
TAPE
REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10
M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
f
:
TUNER
E
:
TAPE
PLAY
G
:
TAPE
REC
N
:
MIC
J
: CD PLAY
c
:
DIGITAL
I
: USB
• Abbreviation
E2
: 120V AC area in E model
E3
: 240V AC area in E model
E51
: Chilean and Peruvian model
AR
: Argentina model
AUS
: Australian model
MX
: Mexican model
Note:
The components identifi ed by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specifi ed.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specifi ed.
•
2
: nonfl ammable resistor.
•
C
: panel designation.
• Abbreviation
MX
: Mexican model