Sony HCD-DX315, Руководство по обслуживанию

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HCD-DX315
HCD-DX315
• Circuit Boards Location
FL board
JACK board
LED board
SW board
I/O board
SPEAKER board
MAIN board
HEATSINK (A) board
HEATSINK (B) board
POWER board
TUNER UNIT
SENSOR board
MOTOR board
SW (1) board
SW (2) board
TRANSLATION board
ENCODER board
• Waveforms
– MAIN Board –
– I/O Board –
200 ns
2.7 Vp-p
5.5 Vp-p
20.3 ns
5
IC3010
rk
(XFSOIN)
1 V/DIV, 10 ns/DIV
4
IC501
qg
(XIN)
1 V/DIV, 100 ns/DIV
2
IC1101
<xx.
(XTALI)
1 V/DIV, 10 ns/DIV
37 ns
1.7 Vp-p
1
IC1101
6
(DVDRFIP)
200 mV/DIV, 100 ns/DIV
900 mVp-p
3
IC1101
<z.,
(YUV3)
500 mV/DIV, 20
µ
s/DIV
H
1.5 Vp-p
7
IC201
wh
(COUT)
8
IC201
wa
(YOUT)
qa
IC201
qh
(CrOUT)
9
IC201
w;
(CYOUT)
0
IC201
qk
(CbOUT)
1 V/DIV, 20
µ
s/DIV
H
2.0 Vp-p
1 V/DIV, 20
µ
s/DIV
2.2 Vp-p
H
500 mV/DIV, 20
µ
s/DIV
H
1.6 Vp-p
1 V/DIV, 20
µ
s/DIV
2.2 Vp-p
H
1.6 Vp-p
H
500 mV/DIV, 20
µ
s/DIV
6
IC201
wd
(CVBS)
500 mV/DIV, 20
µ
s/DIV
H
2.5 Vp-p
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
9 9
2
8 9
4 2
9 8
T E L 1 3 9 4 2 2 9 6 5 1 3 9 9 2 8 9 4 2 9 8 0 5 1 5 1 3 6 7 3
Q Q
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