CSD-TD10/TD30
22
22
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
H
: adjustment for repair.
• Total current is measured with no cassette installed.
• Power voltage is dc 9V and fed with regulated dc power
supply from battery terminal.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
E
: PB
a
: REC
J
: CD
• Abbreviation
CND : Canadian model.
E4
: AC 110-120V/220-240V area in E model.
MX
: Mexican model.
TW
: Taiwan model.
AUS
: Australian model.
SP
: Singapore model.
KR
: Korean model.
Common Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
x
: parts mounted on the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
• Abbreviation
CND : Canadian model.
E4
: AC 110-120V/220-240V area in E model.
MX
: Mexican model.
TW
: Taiwan model.
AUS
: Australian model.
SP
: Singapore model.
KR
: Korean model.
Note:
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
6-5. CIRCUIT BOARDS LOCATION
MAIN board
TC board
DISPLAY board
POWER board
MOTOR board
BATT (A) board
BATT (B) board
BATT (C) board
BATT (C) board
• Waveforms
(Mode: PLAY)
— MAIN Board —
0.85±0.2Vp-p
1
IC402
ql
(RFGO)
500mV/div 0.5µsec/div
D101
D-4
D102
E-3
D103
D-4
D106
C-3
D107
C-3
D108
B-4
D361
D-13
D362
D-13
D363
E-13
D604
B-5
D605
C-5
D606
B-10
D607
B-10
D608
B-9
D609
B-9
D610
C-6
D611
B-10
D808
E-6
D855
C-11
D856
C-10
IC101
D-3
IC102
B-3
IC401
D-9
IC402
E-8
IC601
C-7
IC801
C-12
L401
C-9
Q101
B-4
Q102
B-4
• Semiconductor Location (MAIN Board)
Ref. No.
Location
Ref. No.
Location
Q103
B-4
Q104
C-2
Q105
C-2
Q106
C-2
Q107
C-3
Q108
E-4
Q109
C-4
Q110
C-4
Q111
C-2
Q361
E-13
Q362
D-13
Q403
E-9
Q404
E-10
Q602
B-11
Q603
B-9
Q604
B-9
Q605
B-9
Q801
D-11
Q802
D-11
Q803
F-11
Q804
F-11
Q807
E-12
Q808
D-12
Q809
E-12
Q810
E-12
Q851
C-11
Q852
C-11
Q853
D-10
Q854
E-10
ZD601
B-11
Содержание CSD-TD10
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Страница 47: ...47 CSD TD10 TD30 MEMO ...