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SE-1
RM-ED007
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to
http://www.sony-training.com
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Содержание Bravia KDL-26U2000
Страница 17: ... 17 SE 1 RM ED007 SECTION 2 DISASSEMBLY 2 1 STAND REMOVAL 2 2 REAR COVER REMOVAL ...
Страница 18: ... 18 SE 1 RM ED007 2 3 SPEAKER REMOVAL 2 4 A1 A1P BOARD REMOVAL 1 A1 A1P Board ...
Страница 19: ... 19 SE 1 RM ED007 2 5 BDT BOARD REMOVAL 2 6 G1 G2 BOARD REMOVAL ...
Страница 20: ... 20 SE 1 RM ED007 2 7 H1 H1P BOARD REMOVAL 2 8 H2 H2P BOARD REMOVAL H1 H1P Board H2 H2P Board ...
Страница 21: ... 21 SE 1 RM ED007 2 9 H3 H3P BOARD REMOVAL 2 10 BRACKET REMOVAL H3 H3P Board ...
Страница 22: ... 22 SE 1 RM ED007 2 11 LCD PANEL REMOVAL Six screws ...
Страница 48: ...A B C D E F G H I J K L M N 1 2 3 4 5 6 7 8 9 10 11 O 48 BDT Printed Wiring Board Conductor Side B ...
Страница 89: ...9 927 534 02 Sony Corporation Sony UK Service Promotions Dept English 07AP7100 1 Printed in U K 2007 01 ...