K800 - K810
1202-3085 rev. 2
APPENDIX
A
P
P
E
NDIX
A1200 Ray/UMTS Module ROA 128 1112/Z
Note: Size 23.50 x 19.20 = Nominal PWB-size
Interface-pattern of the module:
Pin number
Copper pad
Soldermask opening
1-152
Round 0.57mm
Round 0.67mm
153-251
Round 1.00mm
Round 1.10mm
252 (pin 1 marking)
Round 0.57mm
Round 0.67mm
The interface have copper between the pads connected to signal: GND
Pins connected to GND could be connected the copper between pads.
Recommended interface-pattern for the motherboard:
Pin number
Copper pad
Soldermask opening
1-152
Round 0.67mm
Round 0.77mm
153-251
Round 1.10mm
Round 1.20mm
252 (pin 1 marking)
Round 0.67mm
Round 0.77mm
The outer layer using this footprint shall be fi lled with copper with good connection to GND. Isolation
between signal copper and GND-plane fi lling: min 0.4mm
Pins / Signal cross-reference:
Pin number
Signal
1 VccB_mix
2-3, 6-8, 10-11, 13-14, 16-17, 18-19, 21 29, 31,
33-34, 40-44, 46, 48-51, 55, 57, 62, 64-65, 67,
72, 73-251, 252
GND
4 XOOB
5 XOOA
9 VccB
12 CLKREQ
15 WRFLOOP
20 WCDMA_ANT
30 WCDMA_SENSE
32 WPABIAS
35-39 VBATI
45 RTEMP
47 XTLDO
52 WSTR
53 WDAT
54 WCLK
56 WON
58 TXIA
59 TXIB
60 TXQA
61 TXQB
63 MCLK
66 VCXOCONT
68 RXIB
69 RXIA
70 RXQB
71 RXQA
Components A1200
SEMC Electrical Repair Manual
74
(121)
Содержание K800
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